Parametric results for: KS-1123 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Pbfree Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 6

13 hits Apply

1.1 inch 3 1.6 inch 3

Min (inch) - Max (inch)

13 hits Apply

0.165 inch 6

13 hits Apply

1.1 inch 3 1.6 inch 3

Min (inch) - Max (inch)

13 hits Apply

11X11 3 16X16 3

13 hits Apply

GOLD OVER NICKEL 8 TIN LEAD OVER NICKEL 3

13 hits Apply

Gold (Au) - with Nickel (Ni) barrier 3 GOLD OVER NICKEL 3 Matte Tin (Sn) - with Nickel (Ni) barrier 1 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 6

13 hits Apply

Contact Material (2)

BERYLLIUM COPPER ALLOY 6 BERYLLIUM COPPER/COPPER ALLOY 4

13 hits Apply

RND PIN-SKT 6

13 hits Apply

IC SOCKET 13

13 hits Apply

DIP112 5 PGA112 8

13 hits Apply

POLYAMIDE 3 POLYIMIDE 10

13 hits Apply

e0 6 e3 1 e4 6

13 hits Apply

Manufacturer (1)

Advanced Interconnections Corp 13

13 hits Apply

0.1 inch 6

13 hits Apply

STRAIGHT 6

13 hits Apply

Number of Contacts (1)

112 13

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400.0 °C 6

13 hits Apply

-269.0 °C 6

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RECTANGULAR 6

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100 µm 6

13 hits Apply

Active 5 Obsolete 8

13 hits Apply

No 2 Yes 2

13 hits Apply

No 6 Yes 4

13 hits Apply

Terminal Pitch (1)

2.54 mm 6

13 hits Apply

SOLDER 6

13 hits Apply