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LM3200TL
National Semiconductor Corporation
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Check for Price | Yes | Transferred | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.2 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | CMOS | OTHER | R-PBGA-B10 | e1 | Not Qualified | 1 | 85 °C | -25 °C | 260 | 40 | 10 | PLASTIC/EPOXY | VFBGA | BGA10,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.819 mm | 2.174 mm | 675 µm | NATIONAL SEMICONDUCTOR CORP | ROHS COMPLIANT, THIN MICRO SMD, 10 PIN | compliant | EAR99 | 8542.39.00.01 | |||||||||
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LM3200TLX/NOPB
Texas Instruments
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Check for Price | No | Yes | Obsolete | 3.6 V | 5.5 V | 2.7 V | 940 mA | YES | BUCK | 2 MHz | ALSO OPERATES IN ADJUSTABLE MODE FROM 0.8 TO 3.6V | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | CMOS | OTHER | R-PBGA-B10 | e1 | Not Qualified | 1 | 85 °C | -25 °C | 260 | 30 | 10 | PLASTIC/EPOXY | VFBGA | BGA10,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.8315 mm | 2.1955 mm | 675 µm | TEXAS INSTRUMENTS INC | VFBGA, BGA10,3X4,20 | compliant | EAR99 | 8542.39.00.01 | |||||||
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LM3200TLX
Texas Instruments
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Check for Price | Yes | Yes | Obsolete | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.2 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | OTHER | R-PBGA-B10 | e1 | Not Qualified | 1 | 85 °C | -25 °C | 10 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.819 mm | 2.174 mm | 675 µm | TEXAS INSTRUMENTS INC | VFBGA, | compliant | EAR99 | 8542.39.00.01 | BGA | 10 | ||||||||||
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LM3200TL
Texas Instruments
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Check for Price | Yes | Yes | Obsolete | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.2 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | OTHER | R-PBGA-B10 | e1 | Not Qualified | 1 | 85 °C | -25 °C | 10 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.819 mm | 2.174 mm | 675 µm | TEXAS INSTRUMENTS INC | ROHS COMPLIANT, THIN MICRO SMD, 10 PIN | compliant | EAR99 | 8542.39.00.01 | BGA | 10 | Texas Instruments | |||||||||
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LM3200TL/NOPB
National Semiconductor Corporation
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Check for Price | Yes | Transferred | 5.5 V | 2.7 V | YES | CMOS | OTHER | R-PBGA-B10 | e1 | Not Qualified | 1 | 85 °C | -25 °C | 260 | 40 | 10 | PLASTIC/EPOXY | FBGA | BGA10,3X4,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | NATIONAL SEMICONDUCTOR CORP | compliant | |||||||||||||||||||||||
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LM3200TLX
National Semiconductor Corporation
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Check for Price | Yes | Transferred | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.2 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | CMOS | OTHER | R-PBGA-B10 | e1 | Not Qualified | 1 | 85 °C | -25 °C | 260 | 40 | 10 | PLASTIC/EPOXY | VFBGA | BGA10,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.819 mm | 2.174 mm | 675 µm | NATIONAL SEMICONDUCTOR CORP | VFBGA, BGA10,3X4,20 | compliant | EAR99 | 8542.39.00.01 | |||||||||
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LM3200TL/NOPB
Texas Instruments
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Check for Price | Yes | Active | 3.6 V | 5.5 V | 2.7 V | 800 mV | 3.6 V | 940 mA | YES | BUCK | 2 MHz | ALSO OPERATES IN ADJUSTABLE MODE FROM 0.8 TO 3.6V | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | CMOS | OTHER | R-PBGA-B10 | e1 | Not Qualified | 1 | 85 °C | -25 °C | 260 | 30 | 10 | PLASTIC/EPOXY | VFBGA | BGA10,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.8315 mm | 2.1955 mm | 675 µm | TEXAS INSTRUMENTS INC | DSBGA-10 | compliant | EAR99 | 8542.39.00.01 | Texas Instruments |