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Parametric results for: LMH6321MR under Buffer Amplifiers

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Manufacturer Part Number: lmh6321mr
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LMH6321MRX/NOPB
 Texas Instruments 		$2.9955 Yes Yes Active 35 mV 110 MHz 1800 V/us 17 µA 14.5 mA 1 BUFFER 15 V -15 V 15 nA -18 V 300 mA 18 V AUTOMOTIVE 110000 R-PDSO-G8 Not Qualified e3 3 125 °C -40 °C 260 30 8 PLASTIC/EPOXY HLSOP SOP8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE TR YES MATTE TIN GULL WING 1.27 mm DUAL 1.68 mm 3.94 mm 4.93 mm TEXAS INSTRUMENTS INC SOIC HLSOP, SOP8,.25 8 compliant EAR99 8542.33.00.01 Texas Instruments
LMH6321MR
 National Semiconductor Corporation 		$4.2497 No Transferred 52 mV 110 MHz 2900 V/us 17 µA 20.5 mA 1 BUFFER 15 V -15 V 17 µA -18 V 300 mA 18 V AUTOMOTIVE R-PDSO-G8 Not Qualified e0 3 125 °C -40 °C 260 40 8 PLASTIC/EPOXY HLSOP SOP8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 1.68 mm 3.94 mm 4.93 mm NATIONAL SEMICONDUCTOR CORP SOIC PSOP-8 8 not_compliant EAR99 8542.33.00.01
LMH6321MR/NOPB
 Texas Instruments 		$4.3999 Yes Yes Obsolete 35 mV 110 MHz 1800 V/us 17 µA 14.5 mA 1 BUFFER 15 V -15 V 15 nA -18 V 300 mA 18 V AUTOMOTIVE 110000 R-PDSO-G8 Not Qualified e3 3 125 °C -40 °C 260 30 8 PLASTIC/EPOXY HLSOP SOP8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE TUBE YES MATTE TIN GULL WING 1.27 mm DUAL 1.68 mm 3.94 mm 4.93 mm TEXAS INSTRUMENTS INC SOIC HLSOP, SOP8,.25 8 compliant EAR99 8542.33.00.01 Texas Instruments
LMH6321MR
 Texas Instruments 		$6.5128 No Obsolete 52 mV 110 MHz 2900 V/us 17 µA 20.5 mA 1 BUFFER 15 V -15 V 17 µA -18 V 300 mA 18 V AUTOMOTIVE R-PDSO-G8 Not Qualified e0 3 125 °C -40 °C 260 8 PLASTIC/EPOXY HLSOP SOP8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE YES TIN LEAD GULL WING 1.27 mm DUAL 1.68 mm 3.94 mm 4.93 mm TEXAS INSTRUMENTS INC SOIC PSOP-8 8 not_compliant EAR99 8542.33.00.01 Texas Instruments
LMH6321MRX
 Texas Instruments 		Check for Price No No Obsolete 52 mV 110 MHz 2900 V/us 17 µA 20.5 mA 1 BUFFER 15 V -15 V 17 µA -18 V 300 mA 18 V AUTOMOTIVE R-PDSO-G8 Not Qualified e0 3 125 °C -40 °C 260 8 PLASTIC/EPOXY HLSOP SOP8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE YES TIN LEAD GULL WING 1.27 mm DUAL 1.68 mm 3.94 mm 4.93 mm TEXAS INSTRUMENTS INC SOIC HLSOP, SOP8,.25 8 not_compliant EAR99 8542.33.00.01 Texas Instruments
LMH6321MRX/NOPB
 National Semiconductor Corporation 		Check for Price Yes Transferred 52 mV 110 MHz 2900 V/us 17 µA 20.5 mA 1 BUFFER 15 V -15 V 17 µA -18 V 300 mA 18 V AUTOMOTIVE R-PDSO-G8 Not Qualified e3 3 125 °C -40 °C 260 40 8 PLASTIC/EPOXY HLSOP SOP8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE YES MATTE TIN GULL WING 1.27 mm DUAL 1.68 mm 3.94 mm 4.93 mm NATIONAL SEMICONDUCTOR CORP SOIC HLSOP, SOP8,.25 8 compliant EAR99 8542.33.00.01
LMH6321MRX
 National Semiconductor Corporation 		Check for Price No Transferred 52 mV 110 MHz 2900 V/us 17 µA 20.5 mA 1 BUFFER 15 V -15 V 17 µA -18 V 300 mA 18 V AUTOMOTIVE R-PDSO-G8 Not Qualified e0 3 125 °C -40 °C 260 40 8 PLASTIC/EPOXY HLSOP SOP8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 1.68 mm 3.94 mm 4.93 mm NATIONAL SEMICONDUCTOR CORP SOIC PSOP-8 8 not_compliant EAR99 8542.33.00.01
LMH6321MR/NOPB
 National Semiconductor Corporation 		Check for Price Yes Transferred 52 mV 110 MHz 2900 V/us 17 µA 20.5 mA 1 BUFFER 15 V -15 V 17 µA -18 V 300 mA 18 V AUTOMOTIVE R-PDSO-G8 Not Qualified e3 3 125 °C -40 °C 260 40 8 PLASTIC/EPOXY HLSOP SOP8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE YES MATTE TIN GULL WING 1.27 mm DUAL 1.68 mm 3.94 mm 4.93 mm NATIONAL SEMICONDUCTOR CORP SOIC HLSOP, SOP8,.25 8 compliant EAR99 8542.33.00.01