Parametric results for: LMV228SD under Cellular Telephone Circuits
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LMV228SD/NOPB
Texas Instruments
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$0.7101 | Yes | Yes | Active | 5 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | R-PDSO-N6 | e3 | 1 | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | DUAL | TEXAS INSTRUMENTS INC | compliant | EAR99 | 8542.39.00.01 | Texas Instruments | |||||||||||||
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LMV228SDX
National Semiconductor Corporation
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Check for Price | No | Transferred | 2.7 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-XDSO-N6 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 40 | 6 | UNSPECIFIED | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 650 µm | DUAL | 2.2 mm | 2.5 mm | 800 µm | NATIONAL SEMICONDUCTOR CORP | not_compliant | 8542.39.00.01 | 2.20 X 2.50 MM, 0.80 MM HEIGHT, LLP-6 | |||||||||
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LMV228SD
Texas Instruments
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Check for Price | No | No | Obsolete | 2.7 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-XDSO-N6 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 6 | UNSPECIFIED | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 650 µm | DUAL | 2.2 mm | 2.5 mm | 800 µm | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | HVSON, | SOIC | 6 | ||||||||
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LMV228SDX
Texas Instruments
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Check for Price | Yes | Yes | Obsolete | 2.7 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-XDSO-N6 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 6 | UNSPECIFIED | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN | NO LEAD | 650 µm | DUAL | 2.2 mm | 2.5 mm | 800 µm | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | HVSON, | SOIC | 6 | ||||||||
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LMV228SDX/NOPB
Texas Instruments
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Check for Price | No | Yes | Obsolete | 5 V | RF AND BASEBAND CIRCUIT | 1 | e3 | 1 | 260 | 30 | MATTE TIN | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | , | |||||||||||||||||||||||||
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LMV228SD
National Semiconductor Corporation
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Check for Price | No | Transferred | 2.7 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-XDSO-N6 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 40 | 6 | UNSPECIFIED | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Tin/Lead (Sn85Pb15) | NO LEAD | 650 µm | DUAL | 2.2 mm | 2.5 mm | 800 µm | NATIONAL SEMICONDUCTOR CORP | not_compliant | 8542.39.00.01 | 2.20 X 2.50 MM, 0.80 MM HEIGHT, LLP-6 |