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Parametric » Telecommunication Circuits » Cellular Telephone Circuits

Parametric results for: LMV228TLX under Cellular Telephone Circuits

Select parts from the table below to compare.

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Select Parts		Part Number

		LMV228TLX/NOPB Texas Instruments
		LMV228TLX Texas Instruments
		LMV228TLX National Semiconductor Corporation

				Most Relevant		Technical				Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Number of Channels	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Package Description	Pin Count

Yes

Yes

Active

5 V

1

RF AND BASEBAND CIRCUIT

1

8 mA

INDUSTRIAL

R-XBGA-B4

e1

1

85 °C

-40 °C

260

30

4

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

BOTTOM

TEXAS INSTRUMENTS INC

compliant

EAR99

8542.39.00.01

Texas Instruments

Check for Price

No

No

Obsolete

2.7 V

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

S-PBGA-B4

Not Qualified

1

85 °C

-40 °C

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.014 mm

1.014 mm

675 µm

TEXAS INSTRUMENTS INC

compliant

8542.39.00.01

DSBGA

VFBGA,

4

Check for Price

No

Transferred

2.7 V

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

S-PBGA-B4

e0

Not Qualified

1

85 °C

-40 °C

260

40

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

500 µm

BOTTOM

1.014 mm

1.014 mm

675 µm

NATIONAL SEMICONDUCTOR CORP

not_compliant

8542.39.00.01

1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4

Compare

Telecommunication Circuits

Texas Instruments

Yes

Yes

Active

5 V

1

RF AND BASEBAND CIRCUIT

1

8 mA

INDUSTRIAL

R-XBGA-B4

e1

1

85 °C

-40 °C

260

30

4

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

BOTTOM

TEXAS INSTRUMENTS INC

compliant

EAR99

8542.39.00.01

Texas Instruments

Telecommunication Circuits

Texas Instruments

Check for Price

No

No

Obsolete

2.7 V

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

S-PBGA-B4

Not Qualified

1

85 °C

-40 °C

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.014 mm

1.014 mm

675 µm

TEXAS INSTRUMENTS INC

compliant

8542.39.00.01

DSBGA

VFBGA,

4

National Semiconductor Corporation

Check for Price

No

Transferred

2.7 V

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

S-PBGA-B4

e0

Not Qualified

1

85 °C

-40 °C

260

40

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

500 µm

BOTTOM

1.014 mm

1.014 mm

675 µm

NATIONAL SEMICONDUCTOR CORP

not_compliant

8542.39.00.01

1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4