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Parametric results for: LS1021AXE7KQB under Other uPs/uCs/Peripheral ICs

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Manufacturer Part Number: ls1021axe7kqb

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Select Parts		Part Number

		LS1021AXE7KQB NXP Semiconductors
		LS1021AXE7KQB Freescale Semiconductor

				Most Relevant			Technical			Compliance		Operating Conditions			Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$40.3991

Yes

Active

YES

1 V

MICROPROCESSOR CIRCUIT

CMOS

1.03 V

970 mV

S-PBGA-B525

260

525

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

2.07 mm

19 mm

NXP SEMICONDUCTORS

19 X 19 MM, 1.92 HEIGHT, PLASTIC, FCBGA-525

compliant

5A002.A.1

8542.31.00.01

NXP

Check for Price

Yes

Transferred

YES

1 V

MICROPROCESSOR CIRCUIT

CMOS

1.03 V

970 mV

S-PBGA-B525

525

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

800 µm

BOTTOM

2.07 mm

19 mm

FREESCALE SEMICONDUCTOR INC

19 X 19 MM, 1.92 HEIGHT, PLASTIC, FCBGA-525

unknown

NXP

Compare

LS1021AXE7KQB

NXP Semiconductors

$40.3991

Yes

Active

YES

1 V

MICROPROCESSOR CIRCUIT

CMOS

1.03 V

970 mV

S-PBGA-B525

260

525

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

2.07 mm

19 mm

NXP SEMICONDUCTORS

19 X 19 MM, 1.92 HEIGHT, PLASTIC, FCBGA-525

compliant

5A002.A.1

8542.31.00.01

NXP

LS1021AXE7KQB

Freescale Semiconductor

Check for Price

Yes

Transferred

YES

1 V

MICROPROCESSOR CIRCUIT

CMOS

1.03 V

970 mV

S-PBGA-B525

525

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

800 µm

BOTTOM

2.07 mm

19 mm

FREESCALE SEMICONDUCTOR INC

19 X 19 MM, 1.92 HEIGHT, PLASTIC, FCBGA-525

unknown

NXP