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Parametric » Microcontrollers and Processors » Bus Controllers

Parametric results for: LSI53C1010-66 under Bus Controllers

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Select Parts		Part Number

		LSI53C1010-66 Broadcom Limited
		LSI53C1010-66 Avago Technologies
		LSI53C1010-66 LSI Corporation

				Most Relevant							Technical						Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bus Compatibility	External Data Bus Width	Address Bus Width	Data Transfer Rate-Max	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Active

PCI

64

64

160 MBps

160 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B329

Not Qualified

e0

70 °C

225

30

329

PLASTIC/EPOXY

BGA

BGA329,23X23,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.6 mm

31 mm

31 mm

BROADCOM INC

31 X 31 MM, 1.27 MM PITCH, PLASTIC, BGA-329

compliant

3A991.A.2

8542.31.00.01

Check for Price

Active

PCI

64

64

160 MBps

160 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B329

Not Qualified

e0

70 °C

225

30

329

PLASTIC/EPOXY

BGA

BGA329,23X23,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.6 mm

31 mm

31 mm

AVAGO TECHNOLOGIES INC

BGA, BGA329,23X23,50

compliant

3A991.A.2

8542.31.00.01

Check for Price

No

No

Transferred

PCI

64

64

160 MBps

160 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B329

Not Qualified

e0

70 °C

329

PLASTIC/EPOXY

BGA

BGA329,23X23,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.6 mm

31 mm

31 mm

LSI CORP

BGA, BGA329,23X23,50

compliant

3A991.A.2

8542.31.00.01

BGA

329

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Broadcom Limited

Check for Price

Active

PCI

64

64

160 MBps

160 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B329

Not Qualified

e0

70 °C

225

30

329

PLASTIC/EPOXY

BGA

BGA329,23X23,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.6 mm

31 mm

31 mm

BROADCOM INC

31 X 31 MM, 1.27 MM PITCH, PLASTIC, BGA-329

compliant

3A991.A.2

8542.31.00.01

Avago Technologies

Check for Price

Active

PCI

64

64

160 MBps

160 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B329

Not Qualified

e0

70 °C

225

30

329

PLASTIC/EPOXY

BGA

BGA329,23X23,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.6 mm

31 mm

31 mm

AVAGO TECHNOLOGIES INC

BGA, BGA329,23X23,50

compliant

3A991.A.2

8542.31.00.01

Microcontrollers and Processors

LSI Corporation

Check for Price

No

No

Transferred

PCI

64

64

160 MBps

160 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B329

Not Qualified

e0

70 °C

329

PLASTIC/EPOXY

BGA

BGA329,23X23,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.6 mm

31 mm

31 mm

LSI CORP

BGA, BGA329,23X23,50

compliant

3A991.A.2

8542.31.00.01

BGA

329