Findchips.com

Register or Sign In

Parametric » Microcontrollers and Processors » Bus Controllers

Parametric results for: LSI53C1010R under Bus Controllers

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		LSI53C1010R LSI Corporation
		LSI53C1010R Avago Technologies
		LSI53C1010R Broadcom Limited

				Most Relevant							Technical							Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bus Compatibility	External Data Bus Width	Address Bus Width	Data Transfer Rate-Max	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Drive Interface Standard	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

No

No

Transferred

PCI

64

64

40 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

IEEE 1149.1

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B456

Not Qualified

e0

70 °C

456

PLASTIC/EPOXY

BGA

BGA456,26X26,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.5 mm

35 mm

35 mm

LSI CORP

BGA

BGA, BGA456,26X26,50

456

compliant

3A991.A.2

8542.31.00.01

Check for Price

Active

PCI

64

64

320 MBps

40 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

IEEE 1149.1

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B456

Not Qualified

e0

70 °C

225

30

456

PLASTIC/EPOXY

BGA

BGA456,26X26,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.5 mm

35 mm

35 mm

AVAGO TECHNOLOGIES INC

BGA, BGA456,26X26,50

compliant

3A991.A.2

8542.31.00.01

Check for Price

Active

PCI

64

64

320 MBps

40 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

IEEE 1149.1

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B456

Not Qualified

e0

70 °C

225

30

456

PLASTIC/EPOXY

BGA

BGA456,26X26,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.5 mm

35 mm

35 mm

BROADCOM INC

35 X 35 MM, 1.27 MM PITCH, PLASTIC, MO-151, EPBGA-456

compliant

3A991.A.2

8542.31.00.01

Compare

Microcontrollers and Processors

LSI Corporation

Check for Price

No

No

Transferred

PCI

64

64

40 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

IEEE 1149.1

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B456

Not Qualified

e0

70 °C

456

PLASTIC/EPOXY

BGA

BGA456,26X26,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.5 mm

35 mm

35 mm

LSI CORP

BGA

BGA, BGA456,26X26,50

456

compliant

3A991.A.2

8542.31.00.01

Avago Technologies

Check for Price

Active

PCI

64

64

320 MBps

40 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

IEEE 1149.1

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B456

Not Qualified

e0

70 °C

225

30

456

PLASTIC/EPOXY

BGA

BGA456,26X26,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.5 mm

35 mm

35 mm

AVAGO TECHNOLOGIES INC

BGA, BGA456,26X26,50

compliant

3A991.A.2

8542.31.00.01

Broadcom Limited

Check for Price

Active

PCI

64

64

320 MBps

40 MHz

YES

3.3 V

BUS CONTROLLER, SCSI

CMOS

IEEE 1149.1

800 mA

3.47 V

3.13 V

COMMERCIAL

S-PBGA-B456

Not Qualified

e0

70 °C

225

30

456

PLASTIC/EPOXY

BGA

BGA456,26X26,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.5 mm

35 mm

35 mm

BROADCOM INC

35 X 35 MM, 1.27 MM PITCH, PLASTIC, MO-151, EPBGA-456

compliant

3A991.A.2

8542.31.00.01