Parametric results for: LTC2175) under Analog to Digital Converters
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LTC2175IUKG-14#PBF
Analog Devices Inc
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$248.7107 | No | Yes | Active | 1.8 V | 2 V | 4 | 0.025 % | 14 | 125 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | SERIAL, PARALLEL, WORD | R-PQCC-N52 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 52 | PLASTIC/EPOXY | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 8 mm | ANALOG DEVICES INC | 7 X 8 MM, LEAD FREE, PLASTIC, QFN-52 | 52 | 05-08-1729 | compliant | Analog Devices | ||||||
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LTC2175CUKG-14#TRPBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 1.8 V | 2 V | 4 | 0.025 % | 14 | 125 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL, PARALLEL, WORD | R-PQCC-N52 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 52 | PLASTIC/EPOXY | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 8 mm | ANALOG DEVICES INC | 7 X 8 MM, LEAD FREE, PLASTIC, QFN-52 | 52 | 05-08-1729 | compliant | Analog Devices | |||||||
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LTC2175CUKG-12#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 1.8 V | 4 | 0.0244 % | 12 | 125 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL | R-PQCC-N52 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 52 | PLASTIC/EPOXY | HVQCCN | LCC52,.27X.31,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 8 mm | LINEAR TECHNOLOGY CORP | 7 X 8 MM, LEAD FREE, PLASTIC, QFN-52 | 52 | UKG | compliant | QFN | 3A991.C.2 | 8542.39.00.01 | ||||||
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LTC2175CUKG-12#PBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 1.8 V | 4 | 0.0244 % | 12 | 125 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL | R-PQCC-N52 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 52 | PLASTIC/EPOXY | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 8 mm | ANALOG DEVICES INC | 7 X 8 MM, LEAD FREE, PLASTIC, QFN-52 | 52 | 05-08-1729 | compliant | Analog Devices | ||||||||
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LTC2175IUKG-12#PBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 1.8 V | 4 | 0.0244 % | 12 | 125 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | SERIAL | R-PQCC-N52 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 52 | PLASTIC/EPOXY | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 8 mm | ANALOG DEVICES INC | 7 X 8 MM, LEAD FREE, PLASTIC, QFN-52 | 52 | 05-08-1729 | compliant | Analog Devices | |||||||
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LTC2175CUKG-14#PBF
Linear Technology
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Check for Price | Yes | Transferred | 1.8 V | 2 V | 4 | 0.025 % | 14 | 125 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL, PARALLEL, WORD | R-PQCC-N52 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 52 | PLASTIC/EPOXY | HVQCCN | LCC52,.27X.31,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 8 mm | LINEAR TECHNOLOGY CORP | 7 X 8 MM, LEAD FREE, PLASTIC, QFN-52 | 52 | UKG | compliant | QFN | 3A991.C.3 | 8542.39.00.01 | |||||
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LTC2175CUKG-14#PBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 1.8 V | 2 V | 4 | 0.025 % | 14 | 125 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL, PARALLEL, WORD | R-PQCC-N52 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 52 | PLASTIC/EPOXY | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 8 mm | ANALOG DEVICES INC | 7 X 8 MM, LEAD FREE, PLASTIC, QFN-52 | 52 | 05-08-1729 | compliant | Analog Devices | |||||||
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LTC2175CUKG-12#PBF
Linear Technology
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Check for Price | Yes | Transferred | 1.8 V | 4 | 0.0244 % | 12 | 125 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL | R-PQCC-N52 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 52 | PLASTIC/EPOXY | HVQCCN | LCC52,.27X.31,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 8 mm | LINEAR TECHNOLOGY CORP | 7 X 8 MM, LEAD FREE, PLASTIC, QFN-52 | 52 | UKG | compliant | QFN | 3A991.C.2 | 8542.39.00.01 | ||||||
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LTC2175CUKG-14#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 1.8 V | 2 V | 4 | 0.025 % | 14 | 125 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL, PARALLEL, WORD | R-PQCC-N52 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 52 | PLASTIC/EPOXY | HVQCCN | LCC52,.27X.31,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 8 mm | LINEAR TECHNOLOGY CORP | 7 X 8 MM, LEAD FREE, PLASTIC, QFN-52 | 52 | UKG | compliant | QFN | 3A991.C.3 | 8542.39.00.01 | |||||
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LTC2175IUKG-12#PBF
Linear Technology
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Check for Price | Yes | Transferred | 1.8 V | 4 | 0.0244 % | 12 | 125 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | SERIAL | R-PQCC-N52 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 52 | PLASTIC/EPOXY | HVQCCN | LCC52,.27X.31,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 8 mm | LINEAR TECHNOLOGY CORP | 7 X 8 MM, LEAD FREE, PLASTIC, QFN-52 | 52 | UKG | compliant | QFN | 3A991.C.2 | 8542.39.00.01 |