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LTC222CS#PBF
Linear Technology
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$2.3591 | Yes | Transferred | 15 V | YES | -15 V | 90 Ω | 400 ns | 300 ns | SPST | CMOS | CAN ALSO OPERATE FROM SINGLE 5V SUPPLY | NO | 1 | 4 | 75 dB | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | COMMERCIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 9.906 mm | 1.752 mm | 3.899 mm | LINEAR TECHNOLOGY CORP | SOIC | PLASTIC, SOIC-16 | 16 | S | compliant | 8542.39.00.01 | |||||||||||||||
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LTC2220CUP
Linear Technology
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$2.4016 | No | Transferred | YES | 3.3 V | CMOS | 1 | COMMERCIAL | S-PQCC-N64 | Not Qualified | e0 | 1 | 70 °C | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LINEAR TECHNOLOGY CORP | QFN | HVQCCN, LCC64,.35SQ,20 | 64 | UP | not_compliant | 8542.39.00.01 | 3A991.C.2 | 1 V | -1 V | ADC, PROPRIETARY METHOD | 0.0366 % | 1 | 12 | OFFSET BINARY, 2'S COMPLEMENT BINARY | PARALLEL, WORD | 170 MHz | SAMPLE | |||||||||||||||||
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LTC222CN#PBF
Linear Technology
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$2.6010 | Yes | Transferred | 15 V | NO | -15 V | 90 Ω | 400 ns | 300 ns | SPST | CMOS | CAN ALSO OPERATE FROM SINGLE 5V SUPPLY | NO | 1 | 4 | 75 dB | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | COMMERCIAL | R-PDIP-T16 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 3.937 mm | 7.62 mm | LINEAR TECHNOLOGY CORP | DIP | PLASTIC, DIP-16 | 16 | N | compliant | 8542.39.00.01 | ||||||||||||||||
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LTC2225CUH#PBF
Linear Technology
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$4.2469 | Yes | Transferred | YES | 3 V | CMOS | 1 | COMMERCIAL | S-PQCC-N32 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | LINEAR TECHNOLOGY CORP | QFN | 5 X 5 MM, LEAD FREE, PLASTIC, MO-220-WHHD, QFN-32 | 32 | UH | compliant | 8542.39.00.01 | 1 V | -1 V | ADC, PROPRIETARY METHOD | 0.0269 % | 1 | 12 | OFFSET BINARY, 2'S COMPLEMENT BINARY | PARALLEL, WORD | 10 MHz | SAMPLE | ||||||||||||||||
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LTC2225IUH#PBF
Linear Technology
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$5.2933 | Yes | Transferred | YES | 3 V | CMOS | 1 | INDUSTRIAL | S-PQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | LINEAR TECHNOLOGY CORP | QFN | 5 X 5 MM, LEAD FREE, PLASTIC, MO-220-WHHD, QFN-32 | 32 | UH | compliant | 8542.39.00.01 | 1 V | -1 V | ADC, PROPRIETARY METHOD | 0.0269 % | 1 | 12 | OFFSET BINARY, 2'S COMPLEMENT BINARY | PARALLEL, WORD | 10 MHz | SAMPLE | |||||||||||||||
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LTC2227CUH#PBF
Linear Technology
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$7.3319 | Yes | Transferred | YES | 3 V | CMOS | 1 | COMMERCIAL | S-PQCC-N32 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | LINEAR TECHNOLOGY CORP | QFN | 5 X 5 MM, LEAD FREE, PLASTIC, MO-220WHHD, QFN-32 | 32 | UH | compliant | 8542.39.00.01 | 1.9 V | 1 V | ADC, PROPRIETARY METHOD | 0.0244 % | 1 | 12 | OFFSET BINARY, 2'S COMPLEMENT BINARY | PARALLEL, WORD | 40 MHz | SAMPLE | ||||||||||||||||
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LTC2226IUH#PBF
Linear Technology
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$8.3224 | Yes | Transferred | YES | 3 V | CMOS | 1 | INDUSTRIAL | S-PQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | LINEAR TECHNOLOGY CORP | QFN | 5 X 5 MM, LEAD FREE, PLASTIC, MO-220WHHD, QFN-32 | 32 | UH | compliant | 8542.39.00.01 | 1.9 V | 1 V | ADC, PROPRIETARY METHOD | 0.0244 % | 1 | 12 | OFFSET BINARY, 2'S COMPLEMENT BINARY | PARALLEL, WORD | 25 MHz | SAMPLE | |||||||||||||||
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LTC2227IUH#PBF
Linear Technology
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$8.8154 | Yes | Transferred | YES | 3 V | CMOS | 1 | INDUSTRIAL | S-PQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | LINEAR TECHNOLOGY CORP | QFN | QFN-32 | 32 | UH | compliant | 8542.39.00.01 | 1.9 V | 1 V | ADC, PROPRIETARY METHOD | 0.0244 % | 1 | 12 | OFFSET BINARY, 2'S COMPLEMENT BINARY | PARALLEL, WORD | 40 MHz | SAMPLE | |||||||||||||||
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LTC2226CUH#PBF
Linear Technology
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$8.8638 | Yes | Transferred | YES | 3 V | CMOS | 1 | COMMERCIAL | S-PQCC-N32 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | LINEAR TECHNOLOGY CORP | QFN | 5 X 5 MM, LEAD FREE, PLASTIC, MO-220WHHD, QFN-32 | 32 | UH | compliant | 8542.39.00.01 | 1.9 V | 1 V | ADC, PROPRIETARY METHOD | 0.0244 % | 1 | 12 | OFFSET BINARY, 2'S COMPLEMENT BINARY | PARALLEL, WORD | 25 MHz | SAMPLE | ||||||||||||||||
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LTC2226HLX#PBF
Linear Technology
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$11.3928 | Yes | Transferred | YES | 3 V | CMOS | 1 | AUTOMOTIVE | S-PQFP-G48 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 7 mm | 1.6 mm | 7 mm | LINEAR TECHNOLOGY CORP | QFP | 7 X 7 MM, LEAD FREE, MS-026, PLASTIC, LQFP-48 | 48 | LX | compliant | 8542.39.00.01 | 1.9 V | 1 V | ADC, PROPRIETARY METHOD | 0.0366 % | 1 | 12 | OFFSET BINARY, 2'S COMPLEMENT BINARY | PARALLEL, WORD | 25 MHz | SAMPLE |