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Parametric » Drivers And Interfaces » Other Interface ICs

Parametric results for: MAX13013EBT-T under Other Interface ICs

Select parts from the table below to compare.

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Select Parts		Part Number

		MAX13013EBT+T Maxim Integrated Products
		MAX13013EBT-T Rochester Electronics LLC
		MAX13013EBT-T Maxim Integrated Products

				Most Relevant		Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Supply Voltage1-Nom	Interface IC Type	Technology	Number of Functions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage1-Max	Supply Voltage1-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Reach Compliance Code	HTS Code	Part Package Code	Package Description	Pin Count	ECCN Code

Check for Price

Yes

Obsolete

BICMOS

YES

INDUSTRIAL

R-PBGA-B6

Not Qualified

e1

1

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

FBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

MAXIM INTEGRATED PRODUCTS INC

compliant

8542.39.00.01

Check for Price

No

Active

2.5 V

1.8 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.65 V

3.2 V

1.2 V

YES

INDUSTRIAL

R-PBGA-B6

COMMERCIAL

1

85 °C

-40 °C

240

20

6

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

BALL

500 µm

BOTTOM

1.98 mm

670 µm

1.75 mm

ROCHESTER ELECTRONICS LLC

unknown

BGA

UCSP-6

6

Check for Price

No

No

Obsolete

2.5 V

1.8 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.65 V

3.2 V

1.2 V

YES

INDUSTRIAL

R-PBGA-B6

Not Qualified

e0

1

85 °C

-40 °C

245

6

PLASTIC/EPOXY

VFBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN LEAD

BALL

500 µm

BOTTOM

1.98 mm

670 µm

1.75 mm

MAXIM INTEGRATED PRODUCTS INC

not_compliant

8542.39.00.01

BGA

UCSP-6

6

EAR99

Compare

Maxim Integrated Products

Check for Price

Yes

Obsolete

BICMOS

YES

INDUSTRIAL

R-PBGA-B6

Not Qualified

e1

1

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

FBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

MAXIM INTEGRATED PRODUCTS INC

compliant

8542.39.00.01

Drivers And Interfaces

Rochester Electronics LLC

Check for Price

No

Active

2.5 V

1.8 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.65 V

3.2 V

1.2 V

YES

INDUSTRIAL

R-PBGA-B6

COMMERCIAL

1

85 °C

-40 °C

240

20

6

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

BALL

500 µm

BOTTOM

1.98 mm

670 µm

1.75 mm

ROCHESTER ELECTRONICS LLC

unknown

BGA

UCSP-6

6

Drivers And Interfaces

Maxim Integrated Products

Check for Price

No

No

Obsolete

2.5 V

1.8 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.65 V

3.2 V

1.2 V

YES

INDUSTRIAL

R-PBGA-B6

Not Qualified

e0

1

85 °C

-40 °C

245

6

PLASTIC/EPOXY

VFBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN LEAD

BALL

500 µm

BOTTOM

1.98 mm

670 µm

1.75 mm

MAXIM INTEGRATED PRODUCTS INC

not_compliant

8542.39.00.01

BGA

UCSP-6

6

EAR99