Findchips: Parametric Search Results for MAX13035E

Parametric results for: MAX13035E under Other Interface ICs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		MAX13035EEBE+T Maxim Integrated Products
		MAX13035EEBE+ Maxim Integrated Products
		MAX13035EETE+ Maxim Integrated Products
		MAX13035EETE+T Maxim Integrated Products
		MAX13035EETE+T Analog Devices Inc
		MAX13035EETE/V+T Maxim Integrated Products
		MAX13035EEBE+T Analog Devices Inc
		MAX13035EETE/V+T Analog Devices Inc
		MAX13035EEBE+ Analog Devices Inc
		MAX13035EETE+ Analog Devices Inc

				Most Relevant		Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Supply Voltage1-Nom	Interface IC Type	Technology	Number of Functions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage1-Max	Supply Voltage1-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Manufacturer Package Code	Date Of Intro	Samacsys Manufacturer

$5.0614

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PBGA-B16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA16,4X4,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2 mm

670 µm

2 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA16,4X4,20

compliant

EAR99

8542.39.00.01

$5.0614

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PBGA-B16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA16,4X4,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.02 mm

670 µm

2.02 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA16,4X4,20

compliant

EAR99

8542.39.00.01

$5.3683

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

650 µm

QUAD

4 mm

800 µm

4 mm

MAXIM INTEGRATED PRODUCTS INC

QFN

4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGC, TQFN-16

compliant

EAR99

8542.39.00.01

$6.9236

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

650 µm

QUAD

4 mm

800 µm

4 mm

MAXIM INTEGRATED PRODUCTS INC

QFN

4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGC, TQFN-16

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

650 µm

QUAD

4 mm

800 µm

4 mm

ANALOG DEVICES INC

16-LFCSP-4X4X0.75

4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGC, TQFN-16

compliant

16-LFCSP-4X4X0.75

2007-02-12

Analog Devices

Check for Price

Yes

Transferred

INTERFACE CIRCUIT

260

MATTE TIN

MAXIM INTEGRATED PRODUCTS INC

compliant

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PBGA-B16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA16,4X4,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2 mm

670 µm

2 mm

16-WLCSP-N/A

2007-02-12

Analog Devices

Check for Price

Yes

Active

INTERFACE CIRCUIT

260

Matte Tin (Sn)

ANALOG DEVICES INC

16-LFCSP-4X4X0.75

compliant

16-LFCSP-4X4X0.75

2007-02-12

Analog Devices

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PBGA-B16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA16,4X4,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2.02 mm

670 µm

2.02 mm

16-WLCSP-N/A

2007-02-12

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn) - annealed

NO LEAD

650 µm

QUAD

4 mm

800 µm

4 mm

ANALOG DEVICES INC

16-LFCSP-4X4X0.75

4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGC, TQFN-16

compliant

16-LFCSP-4X4X0.75

2007-02-12

Analog Devices

1 2 Next

Compare

MAX13035EEBE+T

Maxim Integrated Products

$5.0614

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PBGA-B16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA16,4X4,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2 mm

670 µm

2 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA16,4X4,20

compliant

EAR99

8542.39.00.01

MAX13035EEBE+

Maxim Integrated Products

$5.0614

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PBGA-B16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA16,4X4,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.02 mm

670 µm

2.02 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA16,4X4,20

compliant

EAR99

8542.39.00.01

MAX13035EETE+

Maxim Integrated Products

$5.3683

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

650 µm

QUAD

4 mm

800 µm

4 mm

MAXIM INTEGRATED PRODUCTS INC

QFN

4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGC, TQFN-16

compliant

EAR99

8542.39.00.01

MAX13035EETE+T

Maxim Integrated Products

$6.9236

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

650 µm

QUAD

4 mm

800 µm

4 mm

MAXIM INTEGRATED PRODUCTS INC

QFN

4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGC, TQFN-16

compliant

EAR99

8542.39.00.01

MAX13035EETE+T

Analog Devices Inc

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

650 µm

QUAD

4 mm

800 µm

4 mm

ANALOG DEVICES INC

16-LFCSP-4X4X0.75

4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGC, TQFN-16

compliant

16-LFCSP-4X4X0.75

2007-02-12

Analog Devices

MAX13035EETE/V+T

Maxim Integrated Products

Check for Price

Yes

Transferred

INTERFACE CIRCUIT

260

MATTE TIN

MAXIM INTEGRATED PRODUCTS INC

compliant

MAX13035EEBE+T

Analog Devices Inc

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PBGA-B16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA16,4X4,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2 mm

670 µm

2 mm

16-WLCSP-N/A

2007-02-12

Analog Devices

MAX13035EETE/V+T

Analog Devices Inc

Check for Price

Yes

Active

INTERFACE CIRCUIT

260

Matte Tin (Sn)

ANALOG DEVICES INC

16-LFCSP-4X4X0.75

compliant

16-LFCSP-4X4X0.75

2007-02-12

Analog Devices

MAX13035EEBE+

Analog Devices Inc

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PBGA-B16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA16,4X4,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2.02 mm

670 µm

2.02 mm

16-WLCSP-N/A

2007-02-12

MAX13035EETE+

Analog Devices Inc

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn) - annealed

NO LEAD

650 µm

QUAD

4 mm

800 µm

4 mm

ANALOG DEVICES INC

16-LFCSP-4X4X0.75

4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGC, TQFN-16

compliant

16-LFCSP-4X4X0.75

2007-02-12

Analog Devices

1 2 Next