Findchips: Parametric Search Results for MAX17044X


Select Parts		Part Number

		MAX17044X+U Maxim Integrated Products
		MAX17044X+T10 Analog Devices Inc
		MAX17044X+ Analog Devices Inc
		MAX17044X+T10 Maxim Integrated Products
		MAX17044X+ Maxim Integrated Products

				Most Relevant						Technical			Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Manufacturer Package Code	Date Of Intro	Samacsys Manufacturer

Check for Price

Yes

Obsolete

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

S-PBGA-B9

Not Qualified

70 °C

-20 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.6 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

ROHS COMPLIANT, UCSP-9

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Active

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

9-WLCSP-N/A

2010-05-24

Check for Price

Yes

Active

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

9-WLCSP-N/A

2010-05-24

Analog Devices

Check for Price

Yes

Transferred

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,16

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Transferred

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,16

compliant

EAR99

8542.39.00.01

Compare

MAX17044X+U

Maxim Integrated Products

Check for Price

Yes

Obsolete

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

S-PBGA-B9

Not Qualified

70 °C

-20 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.6 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

ROHS COMPLIANT, UCSP-9

compliant

EAR99

8542.39.00.01

MAX17044X+T10

Analog Devices Inc

Check for Price

Yes

Active

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

9-WLCSP-N/A

2010-05-24

MAX17044X+

Analog Devices Inc

Check for Price

Yes

Active

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

9-WLCSP-N/A

2010-05-24

Analog Devices

MAX17044X+T10

Maxim Integrated Products

Check for Price

Yes

Transferred

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,16

compliant

EAR99

8542.39.00.01

MAX17044X+

Maxim Integrated Products

Check for Price

Yes

Transferred

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,16

compliant

EAR99

8542.39.00.01

Parametric results for: MAX17044X under Power Management Circuits