Parametric results for: MAX1959ETP under Cellular Telephone Circuits
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MAX1959ETP+
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3.6 V | BICMOS | BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 20 | compliant | 8542.39.00.01 | ||
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MAX1959ETP
Rochester Electronics LLC
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Check for Price | No | No | Active | 3.6 V | BICMOS | BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | e0 | COMMERCIAL | 1 | 85 °C | -40 °C | 240 | 20 | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | ROCHESTER ELECTRONICS LLC | QFN | 5 X 5 MM, 0.80 MM HEIGHT, QFN-20 | 20 | unknown | |||
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MAX1959ETP
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.6 V | BICMOS | BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 245 | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 20 | not_compliant | 8542.39.00.01 | |||
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MAX1959ETP-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.6 V | BICMOS | BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 20 | compliant | 8542.39.00.01 |