Parametric results for: MAX2031ETP+T under Cellular Telephone Circuits
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MAX2031ETP+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 5 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | 100 µA | INDUSTRIAL | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.20SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC20,.20SQ,25 | 20 | compliant | 5A991.G | 8542.39.00.01 | ||||
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MAX2031ETP+/+T
Maxim Integrated Products
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Check for Price | Active | 5 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | Not Qualified | 85 °C | -40 °C | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 20 | unknown | |||||||||||||||
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MAX2031ETP+T
Analog Devices Inc
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Check for Price | Yes | Active | 5 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | 100 µA | INDUSTRIAL | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.20SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | 20-LFCSP-5X5X0.75 | 20 | 20-LFCSP-5X5X0.75 | 2005-07-21 | ||||||||
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MAX2031ETP/-T
Maxim Integrated Products
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Check for Price | No | Transferred | 5 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | 100 µA | INDUSTRIAL | S-XQCC-N20 | e0 | Not Qualified | 85 °C | -40 °C | 20 | UNSPECIFIED | HVQCCN | LCC20,.20SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | 5 X 5 MM, MO-220WHHC, TQFN-20 | 20 | not_compliant | 8542.39.00.01 |