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Parametric » Power Circuits » Power Management Circuits

Parametric results for: MAX20323DENC+T under Power Management Circuits

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Select Parts		Part Number

		MAX20323DENC+T Maxim Integrated Products
		MAX20323DENC+T Analog Devices Inc

			Most Relevant						Technical				Compliance		Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Technology	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count	Manufacturer Package Code	Date Of Intro	Samacsys Manufacturer

Check for Price

Yes

Transferred

4.3 V

2.5 V

5.5 V

2

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

BICMOS

INDUSTRIAL

R-PBGA-B12

e2

1

85 °C

-40 °C

260

30

12

PLASTIC/EPOXY

VFBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.318 mm

1.697 mm

500 µm

MAXIM INTEGRATED PRODUCTS INC

WLP-12

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Active

4.3 V

2.5 V

5.5 V

2

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

BICMOS

INDUSTRIAL

R-PBGA-B12

1

85 °C

-40 °C

260

30

12

PLASTIC/EPOXY

VFBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.318 mm

1.697 mm

500 µm

ANALOG DEVICES INC

WLP-12

compliant

12-WLCSP-N/A

12

12-WLCSP-N/A

2017-10-05

Analog Devices

Compare

Maxim Integrated Products

Check for Price

Yes

Transferred

4.3 V

2.5 V

5.5 V

2

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

BICMOS

INDUSTRIAL

R-PBGA-B12

e2

1

85 °C

-40 °C

260

30

12

PLASTIC/EPOXY

VFBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.318 mm

1.697 mm

500 µm

MAXIM INTEGRATED PRODUCTS INC

WLP-12

compliant

EAR99

8542.39.00.01

Analog Devices Inc

Check for Price

Yes

Active

4.3 V

2.5 V

5.5 V

2

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

BICMOS

INDUSTRIAL

R-PBGA-B12

1

85 °C

-40 °C

260

30

12

PLASTIC/EPOXY

VFBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.318 mm

1.697 mm

500 µm

ANALOG DEVICES INC

WLP-12

compliant

12-WLCSP-N/A

12

12-WLCSP-N/A

2017-10-05

Analog Devices