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MAX20353AEWN+
Analog Devices Inc
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$8.3517 | Yes | Active | 3.7 V | 2.7 V | 5.5 V | +2.4V | 5 | YES | NO | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | BICMOS | R-XBGA-B56 | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 56 | UNSPECIFIED | VFBGA | BGA56,7X8,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 500 µm | BOTTOM | 3.678 mm | 4.178 mm | 690 µm | 56-WLCSP-N/A | 56 | 56-WLCSP-N/A | 2020-04-09 | Analog Devices | |||||||
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MAX20353AEWN+T
Maxim Integrated Products
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Check for Price | Yes | Transferred | POWER SUPPLY MANAGEMENT CIRCUIT | e2 | 1 | 260 | 30 | TIN SILVER COPPER NICKEL | MAXIM INTEGRATED PRODUCTS INC | compliant | EAR99 | 8542.39.00.01 | |||||||||||||||||||||||||||||||||
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MAX20353AEWN+T
Analog Devices Inc
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Check for Price | Yes | Active | 3.7 V | 2.7 V | 5.5 V | +2.4V | 5 | YES | NO | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | BICMOS | R-XBGA-B56 | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 56 | UNSPECIFIED | VFBGA | BGA56,7X8,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 500 µm | BOTTOM | 3.678 mm | 4.178 mm | 690 µm | 56-WLCSP-N/A | 56 | 56-WLCSP-N/A | 2020-04-09 | Analog Devices | ANALOG DEVICES INC | compliant | |||||
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MAX20353AEWN+
Maxim Integrated Products
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Check for Price | Yes | Transferred | POWER SUPPLY MANAGEMENT CIRCUIT | e2 | 1 | 260 | 30 | TIN SILVER COPPER NICKEL | MAXIM INTEGRATED PRODUCTS INC | unknown | EAR99 | 8542.39.00.01 | , |