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MAX32626IWY+T
Analog Devices Inc
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Check for Price | Yes | Active | 32 | 96 MHz | 524288 | 163840 | 32 kHz | 40 | YES | 1.2 V | MICROCONTROLLER, RISC | CMOS | ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED | NO | YES | YES | 8 | YES | FLASH | 1.26 V | 1.2 V | OTHER | R-PBGA-B63 | 1 | 85 °C | -30 °C | 260 | 30 | 63 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 400 µm | BOTTOM | 690 µm | 3.068 mm | 3.868 mm | ANALOG DEVICES INC | 63-WLCSP-N/A | WLP-63 | 63 | 63-WLCSP-N/A | compliant | 2016-10-27 | Analog Devices | ||||
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MAX32626IWY+T
Maxim Integrated Products
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Check for Price | Yes | Transferred | 32 | 96 MHz | 524288 | 163840 | 32 kHz | 40 | YES | 1.2 V | MICROCONTROLLER, RISC | CMOS | ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED | NO | YES | YES | 8 | YES | FLASH | 1.26 V | 1.14 V | OTHER | R-PBGA-B63 | e2 | 1 | 85 °C | -30 °C | 260 | 30 | 63 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER NICKEL | BALL | 400 µm | BOTTOM | 690 µm | 3.068 mm | 3.868 mm | MAXIM INTEGRATED PRODUCTS INC | WLP-63 | compliant | 2016-10-28 | 8542.31.00.01 |