Parametric results for: MAX3737ETJ+ under Other Interface ICs
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MAX3737ETJ+
Maxim Integrated Products
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$9.2852 | Yes | Yes | Transferred | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.63 V | 2.97 V | YES | INDUSTRIAL | S-XQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC32,.2SQ,20 | 32 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX3737ETJ
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.63 V | 2.97 V | YES | INDUSTRIAL | S-XQCC-N32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-32 | 32 | not_compliant | 8542.39.00.01 | ||||||||
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MAX3737ETJ+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.63 V | 2.97 V | YES | INDUSTRIAL | S-XQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC32,.2SQ,20 | 32 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX3737ETJ-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.63 V | 2.97 V | YES | INDUSTRIAL | S-XQCC-N32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC32,.2SQ,20 | 32 | not_compliant | 8542.39.00.01 | ||||||||
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MAX3737ETJ+T
Analog Devices Inc
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Check for Price | Yes | Not Recommended | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.63 V | 2.97 V | YES | INDUSTRIAL | S-XQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | 32-LFCSP-5X5X0.75 | 32 | 32-LFCSP-5X5X0.75 | 2003-05-19 | Analog Devices | ||||||||
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MAX3737ETJ+
Analog Devices Inc
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Check for Price | Yes | Not Recommended | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.63 V | 2.97 V | YES | INDUSTRIAL | S-XQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | 32-LFCSP-5X5X0.75 | 32 | 32-LFCSP-5X5X0.75 | 2003-05-19 | Analog Devices |