Parametric results for: MAX379910 under Other Telecom ICs
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MAX3799ETJ+
Maxim Integrated Products
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$3.8609 | Yes | Yes | Transferred | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N32 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | 5 X 5 MM, ROHS COMPLIANT, TQFN-32 | 32 | compliant | EAR99 | 8542.33.00.01 | |||||
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MAX3799ETJ+T
Maxim Integrated Products
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$4.6936 | Yes | Yes | Transferred | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N32 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, | compliant | EAR99 | 8542.33.00.01 | ||||||||
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MAX3799E/D
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XUUC-N45 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 45 | UNSPECIFIED | DIE | SQUARE | UNCASED CHIP | YES | NO LEAD | UPPER | MAXIM INTEGRATED PRODUCTS INC | DIE | DIE, | 45 | compliant | 8542.39.00.01 | |||||||||||||
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MAX3799ETJ+T
Analog Devices Inc
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Check for Price | Yes | Not Recommended | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N32 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | 32-LFCSP-5X5X0.75 | 32 | 32-LFCSP-5X5X0.75 | 2009-08-12 | Analog Devices | |||||||||
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MAX3799ETJ
Maxim Integrated Products
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Check for Price | Yes | No | Transferred | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N32 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 32 | not_compliant | 8542.39.00.01 | |||||||||
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MAX3799ETJ+
Analog Devices Inc
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Check for Price | Yes | Not Recommended | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N32 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | ANALOG DEVICES INC | 32-LFCSP-5X5X0.75 | 5 X 5 MM, ROHS COMPLIANT, TQFN-32 | 32 | compliant | 32-LFCSP-5X5X0.75 | 2009-08-12 | Analog Devices |