Filter Your Search
1 - 5 of 5 results
|
MAX4740HETE+T
Maxim Integrated Products
|
Check for Price | Yes | Yes | Transferred | 3.3 V | YES | 900 mΩ | 60 mΩ | 70 ns | 55 ns | SPDT | BICMOS | 1 | 4 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.6 V | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | compliant | 8542.39.00.01 | ||||||
|
MAX4740HETE+T
Analog Devices Inc
|
Check for Price | Yes | Active | 3.3 V | YES | 900 mΩ | 60 mΩ | 70 ns | 55 ns | SPDT | BICMOS | 1 | 4 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.6 V | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 3 mm | 1 mm | 3 mm | 16-LFCSP-3X3X0.75 | 16 | 16-LFCSP-3X3X0.75 | 2006-05-16 | Analog Devices | ||||||||
|
MAX4740HETE+
Analog Devices Inc
|
Check for Price | Yes | Active | 3.3 V | YES | 900 mΩ | 60 mΩ | 70 ns | 55 ns | SPDT | BICMOS | 1 | 4 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.6 V | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 3 mm | 1 mm | 3 mm | ANALOG DEVICES INC | 16-LFCSP-3X3X0.75 | 3 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, TQFN-16 | 16 | compliant | 16-LFCSP-3X3X0.75 | 2006-05-16 | Analog Devices | |||||
|
MAX4740HETE+
Rochester Electronics LLC
|
Check for Price | Yes | Active | 3.3 V | YES | 900 mΩ | 60 mΩ | 70 ns | 55 ns | SPDT | BICMOS | 1 | 4 | 64 dB | 5.5 V | 1.6 V | INDUSTRIAL | S-XQCC-N16 | COMMERCIAL | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN | NO LEAD | 500 µm | QUAD | 3 mm | 1 mm | 3 mm | ROCHESTER ELECTRONICS LLC | QFN | 3 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, TQFN-16 | 16 | unknown | ||||||||||
|
MAX4740HETE+
Maxim Integrated Products
|
Check for Price | Yes | Yes | Transferred | 3.3 V | YES | 900 mΩ | 60 mΩ | 70 ns | 55 ns | SPDT | BICMOS | 1 | 4 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.6 V | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, TQFN-16 | 16 | compliant | 8542.39.00.01 | EAR99 |