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MAX4788EXS+T
Maxim Integrated Products
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$2.1273 | Yes | Yes | Transferred | 3.3 V | YES | ANALOG CIRCUIT | BICMOS | 1 | 120 µA | 5.5 V | 2.3 V | INDUSTRIAL | R-PDSO-G4 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | TSSOP | TO-253 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 2.025 mm | 1.1 mm | 1.25 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | TSSOP, TO-253 | 4 | compliant | EAR99 | 8542.39.00.01 | |||||||||||
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MAX4787EXS+
Maxim Integrated Products
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$2.2665 | Yes | Yes | Obsolete | ANALOG CIRCUIT | e3 | 1 | 260 | 30 | MATTE TIN | MAXIM INTEGRATED PRODUCTS INC | , | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||||
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MAX4787EXK+T
Maxim Integrated Products
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$2.5072 | Yes | Yes | Transferred | 3.3 V | YES | ANALOG CIRCUIT | BICMOS | 1 | 120 µA | 5.5 V | 2.3 V | INDUSTRIAL | R-PDSO-G5 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | TSSOP | TSSOP5/6,.08 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 2 mm | 1.1 mm | 1.25 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | TSSOP, TSSOP5/6,.08 | 5 | compliant | EAR99 | 8542.39.00.01 | |||||||||||
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MAX4784ETE+
Maxim Integrated Products
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$2.6940 | Yes | Yes | Transferred | 1.8 V | YES | 3 Ω | 30 ns | 15 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 2 | 4 | 2 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | VQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, TQFN-16 | 16 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX4784EUE+
Maxim Integrated Products
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$2.7309 | Yes | Yes | Transferred | 1.8 V | YES | 3 Ω | 30 ns | 15 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 2 | 4 | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 5 mm | 1.1 mm | 4.4 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | TSSOP, TSSOP16,.25 | 16 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX4785EXK+T
Maxim Integrated Products
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$2.7369 | Yes | Yes | Transferred | 3.3 V | YES | ANALOG CIRCUIT | BICMOS | 1 | 120 µA | 5.5 V | 2.3 V | INDUSTRIAL | R-PDSO-G5 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | TSSOP | TSSOP5/6,.08 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 2 mm | 1.1 mm | 1.25 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | TSSOP, TSSOP5/6,.08 | 5 | compliant | EAR99 | 8542.39.00.01 | |||||||||||
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MAX4781ETE+
Maxim Integrated Products
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$2.7595 | Yes | Yes | Transferred | 1.8 V | YES | 2.5 Ω | 300 mΩ | 30 ns | 20 ns | 10 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 8 | 1 | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | compliant | EAR99 | 8542.39.00.01 | ||||
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MAX4789EUK+T
Maxim Integrated Products
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$2.7598 | Yes | Yes | Transferred | 3.3 V | YES | ANALOG CIRCUIT | BICMOS | 1 | 160 µA | 5.5 V | 2.3 V | INDUSTRIAL | R-PDSO-G5 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 950 µm | DUAL | 2.9 mm | 1.45 mm | 1.625 mm | MAXIM INTEGRATED PRODUCTS INC | SOT-23 | SOT-23, 5 PIN | 5 | compliant | EAR99 | 8542.39.00.01 | |||||||||||
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MAX4783EUE+
Maxim Integrated Products
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$2.8030 | Yes | Yes | Transferred | 1.8 V | YES | 2.5 Ω | 300 mΩ | 30 ns | 20 ns | SPDT | CMOS | 1 | 3 | 75 dB | SEPARATE OUTPUT | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 5 mm | 1.1 mm | 4.4 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | TSSOP, TSSOP16,.25 | 16 | compliant | EAR99 | 8542.39.00.01 | ||||
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MAX4781ETE+T
Maxim Integrated Products
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$2.8281 | Yes | Yes | Transferred | 1.8 V | YES | 2.5 Ω | 300 mΩ | 30 ns | 20 ns | 10 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 8 | 1 | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | compliant | EAR99 | 8542.39.00.01 |