Parametric results for: MAX7320ATE+ under Parallel IO Ports
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MAX7320ATE+
Maxim Integrated Products
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$3.8520 | Yes | Yes | Transferred | 8 | 8 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | BICMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.8 MM HEIGHT, LEAD FREE, MO220WEED-2, TQFN-16 | 16 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX7320ATE+
Analog Devices Inc
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Check for Price | Yes | Active | 8 | 8 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | BICMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | ANALOG DEVICES INC | 16-LFCSP-3X3X0.75 | 3 X 3 MM, 0.8 MM HEIGHT, LEAD FREE, MO220WEED-2, TQFN-16 | 16 | compliant | 16-LFCSP-3X3X0.75 | 2005-11-08 | Analog Devices | ||||||
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MAX7320ATE
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 8 | 400 kHz | 8 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | BICMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e0 | 125 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, LCC16,.12SQ,20 | not_compliant | EAR99 | 8542.39.00.01 | ||||||||||
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MAX7320ATE+T
Analog Devices Inc
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Check for Price | Yes | Active | 8 | 8 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | BICMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | 16-LFCSP-3X3X0.75 | 16 | 16-LFCSP-3X3X0.75 | 2005-11-08 | Analog Devices | |||||||||
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MAX7320ATE+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 8 | 8 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | BICMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX7320ATE-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 8 | 400 kHz | 8 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | BICMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e0 | 125 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | not_compliant | EAR99 | 8542.39.00.01 |