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MAX77839BEWL+T
Analog Devices Inc
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Check for Price | Yes | Active | 3.8 V | 5.5 V | 1.8 V | 2.3 V | 5.3 V | 4.4 A | YES | BUCK-BOOST | 2.464 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | R-XBGA-B15 | e2 | 1 | 125 °C | -40 °C | 260 | 30 | 15 | UNSPECIFIED | VFBGA | BGA15,3X5,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 400 µm | BOTTOM | 1.508 mm | 2.068 mm | 690 µm | ANALOG DEVICES INC | 15-WLCSP-N/A | WLP-15 | 15 | 15-WLCSP-N/A | compliant | 2021-01-28 | Analog Devices | ||
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MAX77839BEWL+T
Maxim Integrated Products
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Check for Price | Yes | Transferred | 3.8 V | 5.5 V | 1.8 V | 2.3 V | 5.3 V | 4.4 A | YES | BUCK-BOOST | 2.464 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | R-XBGA-B15 | e2 | 1 | 125 °C | -40 °C | 260 | 30 | 15 | UNSPECIFIED | VFBGA | BGA15,3X5,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER NICKEL | BALL | 400 µm | BOTTOM | 1.508 mm | 2.068 mm | 690 µm | MAXIM INTEGRATED PRODUCTS INC | WLP-15 | compliant |