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MAX77863AEWJ+T
Maxim Integrated Products
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Check for Price | Yes | Transferred | 3.6 V | 2.6 V | 5.5 V | 25 µA | +5.85V | 13 | YES | YES | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | INDUSTRIAL | R-PBGA-B90 | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 90 | PLASTIC/EPOXY | VFBGA | BGA90,.9X10,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER NICKEL | BALL | 400 µm | BOTTOM | 3.775 mm | 4.085 mm | 690 µm | MAXIM INTEGRATED PRODUCTS INC | WLP-90 | compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX77863AEWJ+T
Analog Devices Inc
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Check for Price | Yes | Active | 3.6 V | 2.6 V | 5.5 V | 25 µA | +5.85V | 13 | YES | YES | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | INDUSTRIAL | R-PBGA-B90 | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 90 | PLASTIC/EPOXY | VFBGA | BGA90,.9X10,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 400 µm | BOTTOM | 3.775 mm | 4.085 mm | 690 µm | ANALOG DEVICES INC | WLP-90 | compliant | 90-WLCSP-N/A | 90 | 90-WLCSP-N/A | 2019-10-31 | Analog Devices |