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MAX77874CEWM+T
Analog Devices Inc
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Check for Price | Yes | Active | 3.7 V | 800 mV | 4.8 V | 2.7 V | 250 mV | 1.3 V | 16 A | 3.7 V | YES | BUCK | 2.1 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | R-PBGA-B48 | 1 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6x8,14 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 350 µm | BOTTOM | 2.217 mm | 2.917 mm | 690 µm | ANALOG DEVICES INC | 48-WLCSP-N/A | WLP-48 | 48 | 48-WLCSP-N/A | compliant | 2017-07-20 | |||
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MAX77874CEWM+T
Maxim Integrated Products
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Check for Price | Yes | Transferred | 3.7 V | 800 mV | 4.8 V | 2.7 V | 250 mV | 1.3 V | 16 A | 3.7 V | YES | BUCK | 2.1 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | R-PBGA-B48 | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6x8,14 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER NICKEL | BALL | 350 µm | BOTTOM | 2.217 mm | 2.917 mm | 690 µm | MAXIM INTEGRATED PRODUCTS INC | WLP-48 | compliant |