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MAX9644EBS+TG45
Analog Devices Inc
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Check for Price | Yes | Active | 15 nA | 1.1 µA | 15 µs | 1 | COMPARATOR | 3.3 V | BICMOS | 15 nA | OPEN-DRAIN | 6 V | INDUSTRIAL | S-PBGA-B4 | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | VFBGA | BGA4,2X2,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TR | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 500 µm | BOTTOM | 590 µm | 1 mm | 1 mm | 4-WLCSP-N/A | 4 | 4-WLCSP-N/A | 2011-03-30 | Analog Devices | |||||||
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MAX9644EBS+TG45
Maxim Integrated Products
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Check for Price | Yes | Transferred | 15 nA | 1.1 µA | 15 µs | 1 | COMPARATOR | 3.3 V | BICMOS | 15 nA | OPEN-DRAIN | 6 V | INDUSTRIAL | S-PBGA-B4 | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | VFBGA | BGA4,2X2,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TR | YES | TIN SILVER COPPER NICKEL | BALL | 500 µm | BOTTOM | 590 µm | 1 mm | 1 mm | MAXIM INTEGRATED PRODUCTS INC | VFBGA, | compliant | EAR99 | 8542.39.00.01 |