Findchips: Parametric Search Results for MC13892DJVKR2


Select Parts		Part Number

		MC13892DJVKR2 NXP Semiconductors
		MC13892DJVKR2 Freescale Semiconductor

				Most Relevant							Technical			Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Supply Current-Max (Isup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$7.9400

Yes

Active

3.6 V

1.8 V

3.6 V

1.5 mA

YES

POWER SUPPLY MANAGEMENT CIRCUIT

INDUSTRIAL

S-PBGA-B139

Not Qualified

85 °C

-40 °C

260

139

PLASTIC/EPOXY

TFBGA

BGA139,13X13,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

7 mm

1.2 mm

NXP SEMICONDUCTORS

TFBGA, BGA139,13X13,20

compliant

EAR99

8542.39.00.01

NXP

Check for Price

Yes

Transferred

3.6 V

1.8 V

3.6 V

1.5 mA

YES

POWER SUPPLY MANAGEMENT CIRCUIT

INDUSTRIAL

S-PBGA-B139

Not Qualified

85 °C

-40 °C

260

139

PLASTIC/EPOXY

TFBGA

BGA139,13X13,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER OVER NICKEL

BALL

500 µm

BOTTOM

7 mm

1.2 mm

FREESCALE SEMICONDUCTOR INC

7 X 7 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MO-195AD, BGA-139

unknown

EAR99

8542.39.00.01

NXP

BGA

139

Compare

MC13892DJVKR2

NXP Semiconductors

$7.9400

Yes

Active

3.6 V

1.8 V

3.6 V

1.5 mA

YES

POWER SUPPLY MANAGEMENT CIRCUIT

INDUSTRIAL

S-PBGA-B139

Not Qualified

85 °C

-40 °C

260

139

PLASTIC/EPOXY

TFBGA

BGA139,13X13,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

7 mm

1.2 mm

NXP SEMICONDUCTORS

TFBGA, BGA139,13X13,20

compliant

EAR99

8542.39.00.01

NXP

MC13892DJVKR2

Freescale Semiconductor

Check for Price

Yes

Transferred

3.6 V

1.8 V

3.6 V

1.5 mA

YES

POWER SUPPLY MANAGEMENT CIRCUIT

INDUSTRIAL

S-PBGA-B139

Not Qualified

85 °C

-40 °C

260

139

PLASTIC/EPOXY

TFBGA

BGA139,13X13,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER OVER NICKEL

BALL

500 µm

BOTTOM

7 mm

1.2 mm

FREESCALE SEMICONDUCTOR INC

7 X 7 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MO-195AD, BGA-139

unknown

EAR99

8542.39.00.01

NXP

BGA

139

Parametric results for: MC13892DJVKR2 under Power Management Circuits