Findchips: Parametric Search Results for MC33882PVW


Select Parts		Part Number

		MC33882PVWR2 NXP Semiconductors
		MC33882PVW NXP Semiconductors
		MC33882PVW Freescale Semiconductor
		MC33882PVWR2 Freescale Semiconductor

				Most Relevant						Technical											Compliance		Operating Conditions					Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Supply Voltage1-Nom	Driver Number of Bits	Output Peak Current Limit-Nom	Turn-off Time	Turn-on Time	Interface IC Type	Technology	Built-in Protections	Number of Functions	Output Current Flow Direction	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage1-Max	Supply Voltage1-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$8.5183

Yes

End Of Life

5 V

13 V

3 A

10 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

5.5 V

4.5 V

25 V

8 V

YES

AUTOMOTIVE

R-PDSO-G30

Not Qualified

125 °C

-40 °C

245

PLASTIC/EPOXY

HSSOP

SOP30,.57,32

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

GULL WING

800 µm

DUAL

15.9 mm

3.4 mm

11 mm

NXP SEMICONDUCTORS

ROHS COMPLIANT, HSOP-30

not_compliant

EAR99

8542.39.00.01

NXP

$9.5094

Yes

End Of Life

5 V

13 V

3 A

10 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

5.5 V

4.5 V

25 V

8 V

YES

AUTOMOTIVE

R-PDSO-G30

Not Qualified

125 °C

-40 °C

245

PLASTIC/EPOXY

HSSOP

SOP30,.57,32

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

GULL WING

800 µm

DUAL

15.9 mm

3.4 mm

11 mm

NXP SEMICONDUCTORS

ROHS COMPLIANT, HSOP-30

not_compliant

EAR99

8542.39.00.01

NXP

Check for Price

Yes

Transferred

5 V

13 V

3 A

10 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

5.5 V

4.5 V

25 V

8 V

YES

AUTOMOTIVE

R-PDSO-G30

Not Qualified

125 °C

-40 °C

245

PLASTIC/EPOXY

HSSOP

SOP30,.57,32

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

GULL WING

800 µm

DUAL

15.9 mm

3.4 mm

11 mm

FREESCALE SEMICONDUCTOR INC

ROHS COMPLIANT, HSOP-30

not_compliant

EAR99

8542.39.00.01

NXP

SOIC

Check for Price

Yes

Transferred

5 V

13 V

3 A

10 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

5.5 V

4.5 V

25 V

8 V

YES

AUTOMOTIVE

R-PDSO-G30

Not Qualified

125 °C

-40 °C

245

PLASTIC/EPOXY

HSSOP

SOP30,.57,32

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

GULL WING

800 µm

DUAL

15.9 mm

3.4 mm

11 mm

FREESCALE SEMICONDUCTOR INC

ROHS COMPLIANT, HSOP-30

not_compliant

EAR99

8542.39.00.01

NXP

SOIC

Compare

MC33882PVWR2

NXP Semiconductors

$8.5183

Yes

End Of Life

5 V

13 V

3 A

10 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

5.5 V

4.5 V

25 V

8 V

YES

AUTOMOTIVE

R-PDSO-G30

Not Qualified

125 °C

-40 °C

245

PLASTIC/EPOXY

HSSOP

SOP30,.57,32

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

GULL WING

800 µm

DUAL

15.9 mm

3.4 mm

11 mm

NXP SEMICONDUCTORS

ROHS COMPLIANT, HSOP-30

not_compliant

EAR99

8542.39.00.01

NXP

MC33882PVW

NXP Semiconductors

$9.5094

Yes

End Of Life

5 V

13 V

3 A

10 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

5.5 V

4.5 V

25 V

8 V

YES

AUTOMOTIVE

R-PDSO-G30

Not Qualified

125 °C

-40 °C

245

PLASTIC/EPOXY

HSSOP

SOP30,.57,32

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

GULL WING

800 µm

DUAL

15.9 mm

3.4 mm

11 mm

NXP SEMICONDUCTORS

ROHS COMPLIANT, HSOP-30

not_compliant

EAR99

8542.39.00.01

NXP

MC33882PVW

Freescale Semiconductor

Check for Price

Yes

Transferred

5 V

13 V

3 A

10 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

5.5 V

4.5 V

25 V

8 V

YES

AUTOMOTIVE

R-PDSO-G30

Not Qualified

125 °C

-40 °C

245

PLASTIC/EPOXY

HSSOP

SOP30,.57,32

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

GULL WING

800 µm

DUAL

15.9 mm

3.4 mm

11 mm

FREESCALE SEMICONDUCTOR INC

ROHS COMPLIANT, HSOP-30

not_compliant

EAR99

8542.39.00.01

NXP

SOIC

MC33882PVWR2

Freescale Semiconductor

Check for Price

Yes

Transferred

5 V

13 V

3 A

10 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

5.5 V

4.5 V

25 V

8 V

YES

AUTOMOTIVE

R-PDSO-G30

Not Qualified

125 °C

-40 °C

245

PLASTIC/EPOXY

HSSOP

SOP30,.57,32

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

GULL WING

800 µm

DUAL

15.9 mm

3.4 mm

11 mm

FREESCALE SEMICONDUCTOR INC

ROHS COMPLIANT, HSOP-30

not_compliant

EAR99

8542.39.00.01

NXP

SOIC

Parametric results for: MC33882PVW under Peripheral Drivers