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MC33908NAE
NXP Semiconductors
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$6.0858 | Yes | Active | INTERFACE CIRCUIT | 1 | AUTOMOTIVE | S-PQFP-G48 | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | HLFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | YES | Tin (Sn) | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | NXP SEMICONDUCTORS | 7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MS-026BBC, LQFP-48 | compliant | EAR99 | 8542.39.00.01 | NXP | |||
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MC33908NAER2
NXP Semiconductors
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$8.5250 | Yes | Active | INTERFACE CIRCUIT | 1 | AUTOMOTIVE | S-PQFP-G48 | 3 | 125 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | HLFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | NXP SEMICONDUCTORS | 7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MS-026BBC, LQFP-48 | compliant | EAR99 | 8542.39.00.01 | NXP | |||||
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MC33908NAE
Freescale Semiconductor
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Check for Price | Yes | Yes | Transferred | INTERFACE CIRCUIT | 1 | AUTOMOTIVE | S-PQFP-G48 | e3 | 3 | 125 °C | -40 °C | 48 | PLASTIC/EPOXY | HLFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | FREESCALE SEMICONDUCTOR INC | 7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MS-026BBC, LQFP-48 | compliant | NXP | ||||||
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MC33908NAER2
Freescale Semiconductor
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Check for Price | Yes | Yes | Transferred | INTERFACE CIRCUIT | 1 | AUTOMOTIVE | S-PQFP-G48 | e3 | 3 | 125 °C | -40 °C | 48 | PLASTIC/EPOXY | HLFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | FREESCALE SEMICONDUCTOR INC | 7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MS-026BBC, LQFP-48 | compliant | NXP |