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MC68HC11E1CFNE2
Freescale Semiconductor
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$12.6000 | Yes | Yes | Transferred | 8 | 2 MHz | 512 | 512 | 6800 | 8 | 16 | 8 MHz | 38 | YES | 5 V | MICROCONTROLLER | HCMOS | SEATED HT-CALCULATED | NO | NO | NO | YES | YES | 8 | 8 | NO | OTPROM | 27 mA | 5.5 V | 4.5 V | INDUSTRIAL | S-PQCC-J52 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 52 | PLASTIC/EPOXY | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | MATTE TIN | J BEND | 1.27 mm | QUAD | 5.08 mm | 19.125 mm | 19.125 mm | FREESCALE SEMICONDUCTOR INC | LCC | PLASTIC, LCC-52 | 52 | compliant | EAR99 | 8542.31.00.01 | NXP | |||
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MC68HC11E0CFNE2R
NXP Semiconductors
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$12.8480 | Yes | Obsolete | 8 | 2 MHz | 8 | 16 | 8 MHz | 38 | YES | 5 V | MICROCONTROLLER | HCMOS | NO | NO | YES | NO | 5.5 V | 4.5 V | INDUSTRIAL | S-PQCC-J52 | e3 | 3 | 85 °C | -40 °C | 250 | 30 | 52 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | Tin (Sn) | J BEND | 1.27 mm | QUAD | 5.08 mm | 19.125 mm | 19.125 mm | NXP SEMICONDUCTORS | QCCJ, | compliant | EAR99 | 8542.31.00.01 | NXP | 1988-01-01 | |||||||||||||||||
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MC68HC11E0CFNE3R
NXP Semiconductors
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$13.4850 | Yes | Obsolete | 8 | 3 MHz | 0 | 8 | 16 | 12 MHz | 38 | YES | 5 V | MICROCONTROLLER | HCMOS | SEATED HEIGHT CALCULATED | NO | NO | NO | YES | NO | ROM LESS | 5.5 V | 4.5 V | INDUSTRIAL | S-PQCC-J52 | e3 | 3 | 85 °C | -40 °C | 250 | 30 | 52 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | Tin (Sn) | J BEND | 1.27 mm | QUAD | 5.08 mm | 19.125 mm | 19.125 mm | NXP SEMICONDUCTORS | LCC-52 | compliant | EAR99 | 8542.31.00.01 | NXP | ||||||||||||||
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MC68HC11E1CFNE3
NXP Semiconductors
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$13.8811 | Yes | Obsolete | 8 | 3 MHz | 512 | 512 | 6800 | 8 | 16 | 12 MHz | 38 | YES | 5 V | MICROCONTROLLER | HCMOS | SEATED HT-CALCULATED | NO | NO | NO | YES | YES | 8 | 8 | NO | OTPROM | 35 mA | 5.5 V | 5 V | INDUSTRIAL | S-PQCC-J52 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 52 | PLASTIC/EPOXY | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | Tin (Sn) | J BEND | 1.27 mm | QUAD | 5.08 mm | 19.125 mm | 19.125 mm | NXP SEMICONDUCTORS | PLASTIC, LCC-52 | compliant | EAR99 | 8542.31.00.01 | NXP | 1988-01-01 | ||||||
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MC68HC11E1CFNE2
NXP Semiconductors
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$14.0992 | Yes | Obsolete | 8 | 2 MHz | 512 | 512 | 6800 | 8 | 16 | 8 MHz | 38 | YES | 5 V | MICROCONTROLLER | HCMOS | SEATED HT-CALCULATED | NO | NO | NO | YES | YES | 8 | 8 | NO | OTPROM | 27 mA | 5.5 V | 5 V | INDUSTRIAL | S-PQCC-J52 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 52 | PLASTIC/EPOXY | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | Tin (Sn) | J BEND | 1.27 mm | QUAD | 5.08 mm | 19.125 mm | 19.125 mm | NXP SEMICONDUCTORS | PLASTIC, LCC-52 | compliant | EAR99 | 8542.31.00.01 | NXP | 1988-01-01 | ||||||
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MC68HC11E0CFNE2
NXP Semiconductors
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$14.5925 | Yes | Obsolete | 8 | 2 MHz | 0 | 8 | 16 | 8 MHz | 38 | YES | 5 V | MICROCONTROLLER | HCMOS | SEATED HEIGHT CALCULATED | NO | NO | NO | YES | NO | ROM LESS | 5.5 V | 4.5 V | INDUSTRIAL | S-PQCC-J52 | e3 | 3 | 85 °C | -40 °C | 250 | 30 | 52 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | Tin (Sn) | J BEND | 1.27 mm | QUAD | 5.08 mm | 19.125 mm | 19.125 mm | NXP SEMICONDUCTORS | LCC-52 | compliant | EAR99 | 8542.31.00.01 | NXP | 1988-01-01 | |||||||||||||
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MC68HC11E1VFNE3R
NXP Semiconductors
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$14.6165 | Yes | Obsolete | 8 | 3 MHz | 8 | 16 | 12 MHz | 38 | YES | 5 V | MICROCONTROLLER | NO | YES | NO | 5.5 V | 4.5 V | e3 | 3 | 260 | 40 | 52 | QCCJ | SQUARE | CHIP CARRIER | Tin (Sn) | J BEND | 1.27 mm | QUAD | 19.125 mm | 19.125 mm | NXP SEMICONDUCTORS | compliant | 8542.31.00.01 | NXP | ||||||||||||||||||||||||||||
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MC68HC11E0CFNE3
NXP Semiconductors
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$15.2546 | Yes | Obsolete | 8 | 3 MHz | 0 | 8 | 16 | 12 MHz | 38 | YES | 5 V | MICROCONTROLLER | HCMOS | SEATED HEIGHT CALCULATED | NO | NO | NO | YES | NO | ROM LESS | 5.5 V | 4.5 V | INDUSTRIAL | S-PQCC-J52 | e3 | 3 | 85 °C | -40 °C | 250 | 30 | 52 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | Tin (Sn) | J BEND | 1.27 mm | QUAD | 5.08 mm | 19.125 mm | 19.125 mm | NXP SEMICONDUCTORS | LCC-52 | compliant | EAR99 | 8542.31.00.01 | NXP | 1988-01-01 | |||||||||||||
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MC68HC11E1CFNE2R
NXP Semiconductors
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$15.5869 | Yes | Obsolete | 8 | 2 MHz | 512 | 512 | 6800 | 8 | 16 | 8 MHz | 38 | YES | 5 V | MICROCONTROLLER | CMOS | SEATED HT CALCULATED | NO | NO | NO | YES | YES | 8 | 8 | NO | OTPROM | 27 mA | 5.5 V | 5 V | INDUSTRIAL | S-PQCC-J52 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 52 | PLASTIC/EPOXY | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | Tin (Sn) | J BEND | 1.27 mm | QUAD | 5.08 mm | 19.125 mm | 19.125 mm | NXP SEMICONDUCTORS | PLASTIC, LCC-52 | compliant | EAR99 | 8542.31.00.01 | NXP | 1988-01-01 | ||||||
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MC68HC11E1CFNE3R
NXP Semiconductors
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$15.7151 | Yes | Obsolete | 8 | 3 MHz | 512 | 512 | 6800 | 8 | 16 | 12 MHz | 38 | YES | 5 V | MICROCONTROLLER | HCMOS | SEATED HEIGHT CALCULATED | NO | NO | NO | YES | YES | 8 | 8 | NO | OTPROM | 35 mA | 5.5 V | 5 V | INDUSTRIAL | S-PQCC-J52 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 52 | PLASTIC/EPOXY | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | Tin (Sn) | J BEND | 1.27 mm | QUAD | 5.08 mm | 19.125 mm | 19.125 mm | NXP SEMICONDUCTORS | LCC-52 | compliant | 8542.31.00.01 | NXP | 1988-01-01 |