Filter Your Search
1 - 10 of 62 results
|
MC7447AVU733NB
NXP Semiconductors
|
$125.5769 | Yes | Obsolete | 32 | 733 MHz | 64 | 36 | 167 MHz | YES | 1.3 V | MICROPROCESSOR, RISC | CMOS | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | YES | FLOATING POINT | YES | YES | 1.35 V | 1.25 V | S-CBGA-B360 | Not Qualified | 1 | 260 | 40 | 360 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.8 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | BGA, | unknown | 3A991.A.1 | 8542.31.00.01 | NXP | |||||||
|
MC7447AHX600NB
NXP Semiconductors
|
$187.8900 | No | Obsolete | 32 | 600 MHz | 64 | 36 | 167 MHz | YES | 1.3 V | MICROPROCESSOR, RISC | CMOS | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | YES | FLOATING POINT | YES | YES | 1.35 V | 1.25 V | S-CBGA-B360 | Not Qualified | e0 | 1 | 260 | 40 | 360 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 3.24 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | unknown | 3A991.A.1 | 8542.31.00.01 | NXP | |||||
|
MC7447ATHX1000NB
NXP Semiconductors
|
$332.1894 | No | Obsolete | 32 | 1 GHz | 64 | 36 | 167 MHz | YES | 1.3 V | MICROPROCESSOR, RISC | CMOS | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | YES | FLOATING POINT | YES | YES | 1.35 V | 1.25 V | S-CBGA-B360 | Not Qualified | 1 | 260 | 40 | 360 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 3.24 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | unknown | 3A991.A.1 | 8542.31.00.01 | NXP | |||||||
|
MC7447AVU1000NB
NXP Semiconductors
|
$386.9900 | Yes | Obsolete | 32 | 1 GHz | 64 | 36 | 167 MHz | YES | 1.3 V | MICROPROCESSOR, RISC | CMOS | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | YES | FLOATING POINT | YES | YES | 1.35 V | 1.25 V | S-CBGA-B360 | Not Qualified | 1 | 260 | 40 | 360 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.8 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 | not_compliant | 3A991.A.1 | 8542.31.00.01 | NXP | |||||||
|
MC7447AHX1333LB
NXP Semiconductors
|
$506.1540 | No | Obsolete | 32 | 1.333 GHz | 64 | 36 | 167 MHz | YES | 1.3 V | MICROPROCESSOR, RISC | CMOS | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | YES | FLOATING POINT | YES | YES | 1.35 V | 1.25 V | S-CBGA-B360 | Not Qualified | e0 | 1 | 260 | 40 | 360 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 3.24 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | unknown | 3A991.A.1 | 8542.31.00.01 | NXP | |||||
|
MC7447AHX1167NB
NXP Semiconductors
|
$551.3441 | No | Obsolete | 32 | 1.167 GHz | 64 | 36 | 167 MHz | YES | 1.3 V | MICROPROCESSOR, RISC | CMOS | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | YES | FLOATING POINT | YES | YES | 1.35 V | 1.25 V | S-CBGA-B360 | Not Qualified | e0 | 1 | 260 | 40 | 360 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 3.24 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | unknown | 3A991.A.1 | 8542.31.00.01 | NXP | |||||
|
MC7447AVU1167NB
NXP Semiconductors
|
$637.1800 | Yes | Obsolete | 32 | 1.167 GHz | 64 | 36 | 167 MHz | YES | 1.3 V | MICROPROCESSOR, RISC | CMOS | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | YES | FLOATING POINT | YES | YES | 1.35 V | 1.25 V | S-CBGA-B360 | Not Qualified | 1 | 260 | 40 | 360 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.8 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 | unknown | 3A991.A.1 | 8542.31.00.01 | ||||||||
|
MC7447ATHX1167NB
NXP Semiconductors
|
$1,224.3500 | No | Obsolete | 32 | 1.167 GHz | 64 | 36 | 167 MHz | YES | 1.3 V | MICROPROCESSOR, RISC | CMOS | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | YES | FLOATING POINT | YES | YES | 1.35 V | 1.25 V | S-CBGA-B360 | Not Qualified | e0 | 1 | 260 | 40 | 360 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 3.24 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | BGA, | not_compliant | 3A991.A.1 | 8542.31.00.01 | NXP | |||||
|
MC7447AVS1333LB
Rochester Electronics LLC
|
Check for Price | No | Yes | Active | 32 | 1.333 GHz | 64 | 36 | 167 MHz | YES | 1.3 V | MICROPROCESSOR, RISC | CMOS | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | YES | FLOATING POINT | YES | YES | 1.35 V | 1.25 V | S-CBGA-X360 | COMMERCIAL | 1 | 260 | 40 | 360 | CERAMIC, METAL-SEALED COFIRED | CGA | SQUARE | GRID ARRAY | NOT SPECIFIED | UNSPECIFIED | 1.27 mm | BOTTOM | 2.2 mm | 25 mm | 25 mm | ROCHESTER ELECTRONICS LLC | 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360 | unknown | LGA | 360 | ||||||
|
MC7447AVU1267LB
NXP Semiconductors
|
Check for Price | Yes | Obsolete | 32 | 1.267 GHz | 64 | 36 | 167 MHz | YES | 1.3 V | MICROPROCESSOR, RISC | CMOS | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | YES | FLOATING POINT | YES | YES | 1.35 V | 1.25 V | S-CBGA-B360 | Not Qualified | e2 | 1 | 360 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.8 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 | unknown | 3A991 | 8542.31.00.01 |