Findchips: Parametric Search Results for MC7447AHX1333LB


Select Parts		Part Number

		MC7447AHX1333LB NXP Semiconductors
		MC7447AHX1333LB Freescale Semiconductor
		MC7447AHX1333LB Motorola Semiconductor Products

				Most Relevant							Technical									Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$506.1540

Obsolete

1.333 GHz

167 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 1.8V OR 2.5V SUPPLY

YES

FLOATING POINT

YES

1.35 V

1.25 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

unknown

3A991.A.1

8542.31.00.01

NXP

Check for Price

Transferred

1.333 GHz

167 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 1.8V OR 2.5V SUPPLY

YES

FLOATING POINT

YES

1.35 V

1.25 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

NXP

BGA

360

Check for Price

Transferred

1.333 GHz

YES

MICROPROCESSOR, RISC

CMOS

S-XBGA-B360

Not Qualified

360

CERAMIC

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

MOTOROLA INC

unknown

8542.31.00.01

Compare

MC7447AHX1333LB

NXP Semiconductors

$506.1540

Obsolete

1.333 GHz

167 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 1.8V OR 2.5V SUPPLY

YES

FLOATING POINT

YES

1.35 V

1.25 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

unknown

3A991.A.1

8542.31.00.01

NXP

MC7447AHX1333LB

Freescale Semiconductor

Check for Price

Transferred

1.333 GHz

167 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 1.8V OR 2.5V SUPPLY

YES

FLOATING POINT

YES

1.35 V

1.25 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

NXP

BGA

360

MC7447AHX1333LB

Motorola Semiconductor Products

Check for Price

Transferred

1.333 GHz

YES

MICROPROCESSOR, RISC

CMOS

S-XBGA-B360

Not Qualified

360

CERAMIC

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

MOTOROLA INC

unknown

8542.31.00.01

Parametric results for: MC7447AHX1333LB under Microprocessors