Findchips.com

Register or Sign In

Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: MC7448HX1267ND under Microprocessors

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		MC7448HX1267ND NXP Semiconductors
		MC7448HX1267ND Freescale Semiconductor

				Most Relevant					Technical									Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

No

Obsolete

32

1.267 GHz

1.267 GHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

NO

FIXED POINT

NO

YES

1.1 V

1 V

OTHER

S-CBGA-B360

Not Qualified

e0

1

105 °C

260

40

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

25 mm

NXP SEMICONDUCTORS

BGA, BGA360,19X19,50

unknown

3A991.A.1

8542.31.00.01

NXP

Check for Price

No

No

Transferred

32

1.267 GHz

1.267 GHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

NO

FIXED POINT

NO

YES

1.1 V

1 V

OTHER

S-CBGA-B360

Not Qualified

e0

1

105 °C

260

40

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA, BGA360,19X19,50

not_compliant

3A991.A.1

8542.31.00.01

NXP

BGA

360

Compare

NXP Semiconductors

No

Obsolete

32

1.267 GHz

1.267 GHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

NO

FIXED POINT

NO

YES

1.1 V

1 V

OTHER

S-CBGA-B360

Not Qualified

e0

1

105 °C

260

40

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

25 mm

NXP SEMICONDUCTORS

BGA, BGA360,19X19,50

unknown

3A991.A.1

8542.31.00.01

NXP

Microcontrollers and Processors

Freescale Semiconductor

Check for Price

No

No

Transferred

32

1.267 GHz

1.267 GHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

NO

FIXED POINT

NO

YES

1.1 V

1 V

OTHER

S-CBGA-B360

Not Qualified

e0

1

105 °C

260

40

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA, BGA360,19X19,50

not_compliant

3A991.A.1

8542.31.00.01

NXP

BGA

360