Parametric results for: MC9S08AC60CFDE under Microcontrollers
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MC9S08AC60CFDE
NXP Semiconductors
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$50.7096 | Yes | Active | 8 | 40 MHz | 63280 | 2048 | 16 MHz | 38 | YES | 5 V | MICROCONTROLLER | CMOS | NO | NO | NO | YES | 8 | YES | FLASH | 5.5 V | 2.7 V | AUTOMOTIVE | S-XQCC-N48 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 48 | UNSPECIFIED | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Tin (Sn) | NO LEAD | 500 µm | QUAD | 1 mm | 7 mm | 7 mm | NXP SEMICONDUCTORS | 7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VKKD-2, QFN-48 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||
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MC9S08AC60CFDE
Freescale Semiconductor
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Check for Price | Yes | Yes | Transferred | 8 | 40 MHz | 63280 | 2048 | 16 MHz | 38 | YES | 5 V | MICROCONTROLLER | CMOS | NO | NO | YES | 8 | YES | FLASH | 5.5 V | 2.7 V | AUTOMOTIVE | S-XQCC-N48 | Not Qualified | 3 | 125 °C | -40 °C | 260 | 40 | 48 | UNSPECIFIED | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 1 mm | 7 mm | 7 mm | FREESCALE SEMICONDUCTOR INC | 7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VKKD-2, QFN-48 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | QFN | 48 | |||||
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MC9S08AC60CFDE
Rochester Electronics LLC
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Check for Price | Yes | Active | 8 | 40 MHz | 16 MHz | 38 | YES | 5 V | MICROCONTROLLER | CMOS | NO | NO | YES | YES | FLASH | 5.5 V | 2.7 V | AUTOMOTIVE | S-XQCC-N48 | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 48 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 7 mm | 7 mm | ROCHESTER ELECTRONICS INC | HVQCCN, | unknown | QFN | 48 |