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MCF54450ACVM180
NXP Semiconductors
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$21.2583 | Yes | Active | 32 | 180 MHz | 16 | 14 | YES | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.6 mm | 17 mm | 17 mm | NXP SEMICONDUCTORS | MAPBGA-256 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||
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MCF54450ACVM180
Rochester Electronics LLC
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Check for Price | No | Active | e0 | 3 | 220 | 30 | TIN LEAD | ROCHESTER ELECTRONICS INC | , | unknown | BGA | 256 | ||||||||||||||||||||||||||||||||||
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MCF54450ACVM180
Freescale Semiconductor
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Check for Price | Yes | Yes | Transferred | 32 | 180 MHz | 16 | 14 | YES | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | INDUSTRIAL | S-PBGA-B256 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | TIN SILVER COPPER OVER NICKEL | BALL | 1 mm | BOTTOM | 1.6 mm | 17 mm | 17 mm | FREESCALE SEMICONDUCTOR INC | MAPBGA-256 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | BGA | 256 |