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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: MCF54452CVR200 under Microprocessors

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Select Parts		Part Number

		MCF54452CVR200 Freescale Semiconductor
		MCF54452CVR200 NXP Semiconductors

				Most Relevant							Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Yes

Yes

Transferred

32

200 MHz

32

32

66 MHz

YES

1.5 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.65 V

1.35 V

INDUSTRIAL

S-PBGA-B360

Not Qualified

e2

3

85 °C

-40 °C

260

40

360

PLASTIC/EPOXY

BGA

BGA360,22X22,40

SQUARE

GRID ARRAY

TIN SILVER

BALL

1 mm

BOTTOM

2.48 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

BGA

23 X 23 MM, ROHS COMPLIANT, TEPBGA-360

360

compliant

5A992

8542.31.00.01

NXP

Yes

Obsolete

32

200 MHz

32

32

66 MHz

YES

1.5 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.65 V

1.35 V

INDUSTRIAL

S-PBGA-B360

Not Qualified

e2

3

85 °C

-40 °C

260

40

360

PLASTIC/EPOXY

BGA

BGA360,22X22,40

SQUARE

GRID ARRAY

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.48 mm

23 mm

23 mm

NXP SEMICONDUCTORS

23 X 23 MM, ROHS COMPLIANT, TEPBGA-360

compliant

3A991.A.2

8542.31.00.01

NXP

Compare

Microcontrollers and Processors

Freescale Semiconductor

Yes

Yes

Transferred

32

200 MHz

32

32

66 MHz

YES

1.5 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.65 V

1.35 V

INDUSTRIAL

S-PBGA-B360

Not Qualified

e2

3

85 °C

-40 °C

260

40

360

PLASTIC/EPOXY

BGA

BGA360,22X22,40

SQUARE

GRID ARRAY

TIN SILVER

BALL

1 mm

BOTTOM

2.48 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

BGA

23 X 23 MM, ROHS COMPLIANT, TEPBGA-360

360

compliant

5A992

8542.31.00.01

NXP

NXP Semiconductors

Yes

Obsolete

32

200 MHz

32

32

66 MHz

YES

1.5 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.65 V

1.35 V

INDUSTRIAL

S-PBGA-B360

Not Qualified

e2

3

85 °C

-40 °C

260

40

360

PLASTIC/EPOXY

BGA

BGA360,22X22,40

SQUARE

GRID ARRAY

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.48 mm

23 mm

23 mm

NXP SEMICONDUCTORS

23 X 23 MM, ROHS COMPLIANT, TEPBGA-360

compliant

3A991.A.2

8542.31.00.01

NXP