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Manufacturer Part Number: mcimx257djm4ar2

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Select Parts		Part Number

		MCIMX257DJM4AR2 NXP Semiconductors
		MCIMX257DJM4AR2 Freescale Semiconductor

				Most Relevant		Technical						Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$25.3780

Yes

Active

YES

1.45 V

SoC

CMOS

ALSO REQUIRES 3.3 V I/O SUPPLY

1.52 V

1.38 V

OTHER

S-PBGA-B400

Not Qualified

70 °C

-20 °C

260

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.6 mm

17 mm

NXP SEMICONDUCTORS

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400

compliant

5A992.C

8542.31.00.01

NXP

Check for Price

Yes

Transferred

YES

1.45 V

SoC

CMOS

ALSO REQUIRES 3.3 V I/O SUPPLY

1.52 V

1.38 V

OTHER

S-PBGA-B400

Not Qualified

70 °C

-20 °C

260

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER OVER NICKEL

BALL

800 µm

BOTTOM

1.6 mm

17 mm

FREESCALE SEMICONDUCTOR INC

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400

compliant

5A002

8542.31.00.01

NXP

BGA

400

Compare

MCIMX257DJM4AR2

NXP Semiconductors

$25.3780

Yes

Active

YES

1.45 V

SoC

CMOS

ALSO REQUIRES 3.3 V I/O SUPPLY

1.52 V

1.38 V

OTHER

S-PBGA-B400

Not Qualified

70 °C

-20 °C

260

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.6 mm

17 mm

NXP SEMICONDUCTORS

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400

compliant

5A992.C

8542.31.00.01

NXP

MCIMX257DJM4AR2

Freescale Semiconductor

Check for Price

Yes

Transferred

YES

1.45 V

SoC

CMOS

ALSO REQUIRES 3.3 V I/O SUPPLY

1.52 V

1.38 V

OTHER

S-PBGA-B400

Not Qualified

70 °C

-20 °C

260

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER OVER NICKEL

BALL

800 µm

BOTTOM

1.6 mm

17 mm

FREESCALE SEMICONDUCTOR INC

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400

compliant

5A002

8542.31.00.01

NXP

BGA

400