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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: MCIMX31LDVMN5D under Microprocessors

Select parts from the table below to compare.

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Select Parts		Part Number

		MCIMX31LDVMN5DR2 NXP Semiconductors
		MCIMX31LDVMN5D Rochester Electronics LLC
		MCIMX31LDVMN5DR2 Freescale Semiconductor

				Most Relevant						Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	uPs/uCs/Peripheral ICs Type	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Package Description	Pin Count

Yes

Active

YES

MULTIFUNCTION PERIPHERAL

COMMERCIAL

S-PBGA-B473

Not Qualified

e1

3

70 °C

-20 °C

260

40

473

PLASTIC/EPOXY

FBGA

BGA473,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

NXP SEMICONDUCTORS

compliant

5A992.C

8542.31.00.01

NXP

Check for Price

Yes

Yes

Active

32

532 MHz

16

26

75 MHz

YES

MICROPROCESSOR

UNAVAILABLE FOR IMPORT OR SALE IN US

YES

FIXED POINT

YES

YES

1.65 V

1.52 V

OTHER

S-PBGA-B473

COMMERCIAL

e1

3

70 °C

-20 °C

260

40

473

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.54 mm

14 mm

14 mm

ROCHESTER ELECTRONICS LLC

unknown

BGA

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473

473

Check for Price

Yes

Yes

Transferred

YES

MULTIFUNCTION PERIPHERAL

COMMERCIAL

S-PBGA-B473

Not Qualified

3

70 °C

-20 °C

260

40

473

PLASTIC/EPOXY

FBGA

BGA473,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

TIN SILVER COPPER OVER NICKEL

BALL

800 µm

BOTTOM

FREESCALE SEMICONDUCTOR INC

unknown

NXP

Compare

MCIMX31LDVMN5DR2

NXP Semiconductors

Yes

Active

YES

MULTIFUNCTION PERIPHERAL

COMMERCIAL

S-PBGA-B473

Not Qualified

e1

3

70 °C

-20 °C

260

40

473

PLASTIC/EPOXY

FBGA

BGA473,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

NXP SEMICONDUCTORS

compliant

5A992.C

8542.31.00.01

NXP

Microcontrollers and Processors

Rochester Electronics LLC

Check for Price

Yes

Yes

Active

32

532 MHz

16

26

75 MHz

YES

MICROPROCESSOR

UNAVAILABLE FOR IMPORT OR SALE IN US

YES

FIXED POINT

YES

YES

1.65 V

1.52 V

OTHER

S-PBGA-B473

COMMERCIAL

e1

3

70 °C

-20 °C

260

40

473

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.54 mm

14 mm

14 mm

ROCHESTER ELECTRONICS LLC

unknown

BGA

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473

473

MCIMX31LDVMN5DR2

Freescale Semiconductor

Check for Price

Yes

Yes

Transferred

YES

MULTIFUNCTION PERIPHERAL

COMMERCIAL

S-PBGA-B473

Not Qualified

3

70 °C

-20 °C

260

40

473

PLASTIC/EPOXY

FBGA

BGA473,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

TIN SILVER COPPER OVER NICKEL

BALL

800 µm

BOTTOM

FREESCALE SEMICONDUCTOR INC

unknown

NXP