Findchips: Parametric Search Results for MCIMX536AVV8CR2


Select Parts		Part Number

		MCIMX536AVV8CR2 NXP Semiconductors
		MCIMX536AVV8CR2 Freescale Semiconductor

				Most Relevant							Technical										Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$40.5132

Yes

Obsolete

800 MHz

27 MHz

YES

1.1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.45 A

1.15 V

1.05 V

AUTOMOTIVE

S-PBGA-B529

Not Qualified

125 °C

-40 °C

260

529

PLASTIC/EPOXY

HBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

800 µm

BOTTOM

1.85 mm

19 mm

NXP SEMICONDUCTORS

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529

compliant

5A992.C

8542.31.00.01

NXP

Check for Price

Yes

Transferred

800 MHz

27 MHz

YES

1.1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.15 V

1.05 V

AUTOMOTIVE

S-PBGA-B529

125 °C

-40 °C

260

529

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

800 µm

BOTTOM

1.85 mm

19 mm

FREESCALE SEMICONDUCTOR INC

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529

compliant

5A002.A

8542.31.00.01

NXP

Compare

MCIMX536AVV8CR2

NXP Semiconductors

$40.5132

Yes

Obsolete

800 MHz

27 MHz

YES

1.1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.45 A

1.15 V

1.05 V

AUTOMOTIVE

S-PBGA-B529

Not Qualified

125 °C

-40 °C

260

529

PLASTIC/EPOXY

HBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

800 µm

BOTTOM

1.85 mm

19 mm

NXP SEMICONDUCTORS

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529

compliant

5A992.C

8542.31.00.01

NXP

MCIMX536AVV8CR2

Freescale Semiconductor

Check for Price

Yes

Transferred

800 MHz

27 MHz

YES

1.1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.15 V

1.05 V

AUTOMOTIVE

S-PBGA-B529

125 °C

-40 °C

260

529

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

800 µm

BOTTOM

1.85 mm

19 mm

FREESCALE SEMICONDUCTOR INC

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529

compliant

5A002.A

8542.31.00.01

NXP

Parametric results for: MCIMX536AVV8CR2 under Microprocessors