Findchips: Parametric Search Results for MCIMX6Q5EYM10AC


Select Parts		Part Number

		MCIMX6Q5EYM10AC Freescale Semiconductor
		MCIMX6Q5EYM10AC NXP Semiconductors
		MCIMX6Q5EYM10ACR Freescale Semiconductor
		MCIMX6Q5EYM10ACR NXP Semiconductors

				Most Relevant					Technical										Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Speed	External Data Bus Width	Address Bus Width	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$41.0442

Yes

Transferred

YES

SoC

CMOS

24MHZ NOMINAL FREQ AVAILABLE

1.5 V

1.35 V

OTHER

S-PBGA-B624

Not Qualified

105 °C

-20 °C

260

624

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.6 mm

21 mm

FREESCALE SEMICONDUCTOR INC

FCBGA-624

compliant

5A992

8542.31.00.01

NXP

$65.1808

Yes

Not Recommended

YES

SoC

CMOS

24MHZ NOMINAL FREQ AVAILABLE

1.5 V

1.35 V

OTHER

S-PBGA-B624

105 °C

-20 °C

260

624

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.6 mm

21 mm

NXP SEMICONDUCTORS

FCBGA-624

compliant

5A992.C

8542.31.00.01

NXP

Check for Price

Yes

Transferred

1 GHz

YES

1.4 V

MULTIFUNCTION PERIPHERAL

CMOS

YES

FIXED POINT

YES

1.5 V

1.35 V

S-PBGA-B624

260

624

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.6 mm

21 mm

FREESCALE SEMICONDUCTOR INC

21 X 21 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034, FCBGA-624

compliant

5A992

8542.31.00.01

NXP

Check for Price

Yes

Not Recommended

1 GHz

YES

1.4 V

MULTIFUNCTION PERIPHERAL

CMOS

YES

FIXED POINT

YES

1.5 V

1.35 V

S-PBGA-B624

260

624

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.6 mm

21 mm

NXP SEMICONDUCTORS

21 X 21 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034, FCBGA-624

compliant

5A992.C

8542.31.00.01

NXP

Compare

MCIMX6Q5EYM10AC

Freescale Semiconductor

$41.0442

Yes

Transferred

YES

SoC

CMOS

24MHZ NOMINAL FREQ AVAILABLE

1.5 V

1.35 V

OTHER

S-PBGA-B624

Not Qualified

105 °C

-20 °C

260

624

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.6 mm

21 mm

FREESCALE SEMICONDUCTOR INC

FCBGA-624

compliant

5A992

8542.31.00.01

NXP

MCIMX6Q5EYM10AC

NXP Semiconductors

$65.1808

Yes

Not Recommended

YES

SoC

CMOS

24MHZ NOMINAL FREQ AVAILABLE

1.5 V

1.35 V

OTHER

S-PBGA-B624

105 °C

-20 °C

260

624

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.6 mm

21 mm

NXP SEMICONDUCTORS

FCBGA-624

compliant

5A992.C

8542.31.00.01

NXP

MCIMX6Q5EYM10ACR

Freescale Semiconductor

Check for Price

Yes

Transferred

1 GHz

YES

1.4 V

MULTIFUNCTION PERIPHERAL

CMOS

YES

FIXED POINT

YES

1.5 V

1.35 V

S-PBGA-B624

260

624

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.6 mm

21 mm

FREESCALE SEMICONDUCTOR INC

21 X 21 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034, FCBGA-624

compliant

5A992

8542.31.00.01

NXP

MCIMX6Q5EYM10ACR

NXP Semiconductors

Check for Price

Yes

Not Recommended

1 GHz

YES

1.4 V

MULTIFUNCTION PERIPHERAL

CMOS

YES

FIXED POINT

YES

1.5 V

1.35 V

S-PBGA-B624

260

624

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.6 mm

21 mm

NXP SEMICONDUCTORS

21 X 21 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034, FCBGA-624

compliant

5A992.C

8542.31.00.01

NXP

Parametric results for: MCIMX6Q5EYM10AC under Multifunction Peripherals