Parametric results for: MCRF355 under Other Telecom ICs
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MCRF355/WF
Microchip Technology Inc
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Check for Price | Yes | Yes | Not Recommended | 2.4 V | CMOS | TELECOM CIRCUIT | 1 | COMMERCIAL | X-XUUC-N6 | e3 | Not Qualified | 70 °C | -20 °C | 6 | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | YES | MATTE TIN | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | DIE | 0.008 INCH, BACKGRIND DIE-6 | 6 | compliant | 8542.39.00.01 | |||||||||||
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MCRF355/WQ11
Microchip Technology Inc
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Check for Price | Yes | Yes | Not Recommended | 2.4 V | CMOS | TELECOM CIRCUIT | 1 | COMMERCIAL | X-XUUC-N6 | e3 | Not Qualified | 70 °C | -20 °C | 6 | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | YES | MATTE TIN | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | DIE | 0.011 INCH, BACKGRIND DIE-6 | 6 | compliant | 8542.39.00.01 | |||||||||||
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MCRF355/SB
Microchip Technology Inc
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Check for Price | Yes | Yes | Not Recommended | CMOS | TELECOM CIRCUIT | 1 | COMMERCIAL | R-XUUC-N6 | e3 | Not Qualified | 70 °C | -20 °C | 6 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | MATTE TIN | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | DIE | 0.008 INCH, BUMP, DIE-6 | 6 | compliant | 8542.39.00.01 | ||||||||||||
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MCRF355/WB
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | CMOS | TELECOM CIRCUIT | 1 | COMMERCIAL | R-XUUC-N6 | e3 | Not Qualified | 70 °C | -20 °C | 6 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | MATTE TIN | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | WAFER | 0.008 INCH, BACKGRIND, BUMP, WAFER-6 | 6 | compliant | 8542.39.00.01 | ||||||||||||
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MCRF355/SNQ11
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 2.4 V | CMOS | TELECOM CIRCUIT | 1 | 10 nA | COMMERCIAL | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | -20 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.91 mm | 4.9 mm | 1.75 mm | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 8 | compliant | 8542.39.00.01 | ||
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MCRF355/WFQ11
Microchip Technology Inc
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Check for Price | Yes | Yes | Not Recommended | 2.4 V | CMOS | TELECOM CIRCUIT | 1 | COMMERCIAL | X-XUUC-N6 | e3 | Not Qualified | 70 °C | -20 °C | 6 | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | YES | MATTE TIN | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | DIE | 0.008 INCH, BACKGRIND DIE-6 | 6 | compliant | 8542.39.00.01 | |||||||||||
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MCRF355/WFB
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | CMOS | TELECOM CIRCUIT | 1 | COMMERCIAL | R-XUUC-N6 | e3 | Not Qualified | 70 °C | -20 °C | 6 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | MATTE TIN | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | WAFER | 0.008 INCH, BACKGRIND, BUMP, WAFER-6 | 6 | compliant | 8542.39.00.01 | ||||||||||||
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MCRF355/SQ11
Microchip Technology Inc
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Check for Price | Yes | Yes | Not Recommended | 2.4 V | CMOS | TELECOM CIRCUIT | 1 | COMMERCIAL | X-XUUC-N6 | e3 | Not Qualified | 70 °C | -20 °C | 6 | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | YES | MATTE TIN | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | DIE | 0.008 INCH, DIE-6 | 6 | compliant | 8542.39.00.01 | |||||||||||
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MCRF355/PQ11
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 2.4 V | CMOS | TELECOM CIRCUIT | 1 | 10 nA | COMMERCIAL | R-PDIP-T8 | e3 | Not Qualified | 70 °C | -20 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.46 mm | 4.32 mm | MICROCHIP TECHNOLOGY INC | DIP | 0.300 INCH, PLASTIC, MS-001, DIP-8 | 8 | compliant | 8542.39.00.01 | |||||
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MCRF355/W
Microchip Technology Inc
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Check for Price | Yes | Yes | Not Recommended | 2.4 V | CMOS | TELECOM CIRCUIT | 1 | COMMERCIAL | X-XUUC-N6 | e3 | Not Qualified | 70 °C | -20 °C | 6 | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | YES | MATTE TIN | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | DIE | 0.011 INCH, BACKGRIND DIE-6 | 6 | compliant | 8542.39.00.01 |