Parametric results for: MD0101 under Other Telecom ICs
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MD0101K6-G
Microchip Technology Inc
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$4.1543 | Yes | Active | TELECOM CIRCUIT | 1 | AUTOMOTIVE | S-PDSO-N18 | e4 | Not Qualified | 125 °C | -40 °C | 18 | PLASTIC/EPOXY | HVSON | SOLCC18,.20SQ,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 5 mm | 5 mm | 1 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | Microchip | |||||
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MD0101K6-GM932
Microchip Technology Inc
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Check for Price | Yes | Obsolete | TELECOM CIRCUIT | 1 | AUTOMOTIVE | S-XDSO-N18 | 125 °C | -40 °C | 18 | UNSPECIFIED | HVSON | SOLCC18,.20, 20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | DUAL | 5 mm | 5 mm | 1 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | 5 X 5 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, MO-229VJJD-2, DFN-18 | ||||||||
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MD0101K6-GM932
Supertex Inc
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Check for Price | Yes | Transferred | TELECOM CIRCUIT | 1 | AUTOMOTIVE | S-PDSO-N18 | e3 | 125 °C | -40 °C | 18 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | DUAL | 5 mm | 5 mm | 1 mm | SUPERTEX INC | unknown | 8542.39.00.01 | HVSON, | |||||||
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MD0101K6-G
Supertex Inc
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Check for Price | Yes | Transferred | TELECOM CIRCUIT | 1 | S-PDSO-N18 | e3 | Not Qualified | 18 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | DUAL | 5 mm | 5 mm | 1 mm | SUPERTEX INC | unknown | 8542.39.00.01 | HVSON, | SON | 18 |