Parametric results for: MPC555LFMVR40 under Microcontrollers

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Manufacturer Part Number: mpc555lfmvr40
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MPC555LFMVR40
NXP Semiconductors
$130.4876 Yes End Of Life 32 40 MHz 458752 26624 MPC500 32 24 20 MHz 101 3 YES 3.3 V MICROCONTROLLER, RISC HCMOS ALSO REQUIRES 5V SUPPLY YES NO NO FLOATING POINT YES YES 4 8 8 YES FLASH 3.6 V 3 V AUTOMOTIVE S-PBGA-B272 Not Qualified e1 3 125 °C -40 °C 260 40 272 PLASTIC/EPOXY BGA BGA272,20X20,50 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.65 mm 27 mm 27 mm NXP SEMICONDUCTORS BGA, compliant 3A991.A.2 8542.31.00.01 1997-09-16 NXP
MPC555LFMVR40
Freescale Semiconductor
Check for Price Yes Yes Transferred 32 40 MHz 458752 26624 MPC500 32 24 20 MHz 101 3 YES 3.3 V MICROCONTROLLER, RISC HCMOS ALSO REQUIRES 5V SUPPLY YES NO NO FLOATING POINT YES YES 4 8 8 YES FLASH 22 mA 3.6 V 3 V AUTOMOTIVE S-PBGA-B272 Not Qualified e1 3 125 °C -40 °C 260 40 272 PLASTIC/EPOXY BGA BGA272,20X20,50 SQUARE GRID ARRAY TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.65 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272 unknown 3A991.A.2 8542.31.00.01 NXP BGA 272
MPC555LFMVR40
Rochester Electronics LLC
Check for Price No Active 32 40 MHz 32 24 20 MHz 101 YES 3.3 V MICROCONTROLLER, RISC HCMOS NO NO YES YES FLASH 3.6 V 3 V AUTOMOTIVE S-PBGA-B272 e0 3 125 °C -40 °C 235 30 272 PLASTIC/EPOXY BGA SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.65 mm 27 mm 27 mm ROCHESTER ELECTRONICS INC BGA, unknown BGA 272
MPC555LFMVR40
onsemi
Check for Price Obsolete 32 40 MHz 458752 26624 MPC500 32 24 20 MHz 101 3 YES 3.3 V MICROCONTROLLER, RISC HCMOS ALSO REQUIRES 5V SUPPLY YES NO NO FLOATING POINT YES YES 4 8 8 YES FLASH 3.6 V 3 V AUTOMOTIVE S-PBGA-B272 Not Qualified 125 °C -40 °C 272 PLASTIC/EPOXY BGA BGA272,20X20,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 2.65 mm 27 mm 27 mm ON SEMICONDUCTOR BGA, unknown 8542.31.00.01 BGA 272