Findchips: Parametric Search Results for MPC563MZP66R2


Select Parts		Part Number

		MPC563MZP66R2 Motorola Semiconductor Products
		MPC563MZP66R2 Freescale Semiconductor
		MPC563MZP66R2 Motorola Mobility LLC
		MPC563MZP66R2 NXP Semiconductors

				Most Relevant										Technical											Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	ROM (words)	RAM (bytes)	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Number of I/O Lines	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	DAC Channels	DMA Channels	Has ADC	On Chip Program ROM Width	PWM Channels	ROM Programmability	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count	ECCN Code

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Transferred

66 MHz

20 MHz

YES

2.6 V

MICROCONTROLLER, RISC

CMOS

FLASH

2.7 V

2.5 V

AUTOMOTIVE

S-PBGA-B388

Not Qualified

125 °C

-40 °C

388

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1 mm

BOTTOM

2.55 mm

27 mm

MOTOROLA INC

27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388

unknown

8542.31.00.01

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Transferred

66 MHz

524288

32768

20 MHz

YES

2.6 V

MICROCONTROLLER, RISC

CMOS

FLASH

2.7 V

2.5 V

AUTOMOTIVE

S-PBGA-B388

Not Qualified

125 °C

-40 °C

240

388

PLASTIC/EPOXY

BGA

BGA388,26X26,40

SQUARE

GRID ARRAY

Tin/Lead/Silver (Sn62Pb36Ag2)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388

not_compliant

8542.31.00.01

BGA

388

3A991.A.2

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Transferred

66 MHz

20 MHz

YES

2.6 V

MICROCONTROLLER, RISC

CMOS

FLASH

2.7 V

2.5 V

AUTOMOTIVE

S-PBGA-B388

Not Qualified

125 °C

-40 °C

388

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1 mm

BOTTOM

2.55 mm

27 mm

MOTOROLA INC

BGA,

unknown

8542.31.00.01

BGA

388

Check for Price

Not Recommended

66 MHz

524288

32768

20 MHz

YES

2.6 V

MICROCONTROLLER, RISC

CMOS

FLASH

2.7 V

2.5 V

AUTOMOTIVE

S-PBGA-B388

Not Qualified

125 °C

-40 °C

240

388

PLASTIC/EPOXY

BGA

BGA388,26X26,40

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388

unknown

8542.31.00.01

3A991.A.2

Compare

MPC563MZP66R2

Motorola Semiconductor Products

Check for Price

Transferred

66 MHz

20 MHz

YES

2.6 V

MICROCONTROLLER, RISC

CMOS

FLASH

2.7 V

2.5 V

AUTOMOTIVE

S-PBGA-B388

Not Qualified

125 °C

-40 °C

388

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1 mm

BOTTOM

2.55 mm

27 mm

MOTOROLA INC

27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388

unknown

8542.31.00.01

MPC563MZP66R2

Freescale Semiconductor

Check for Price

Transferred

66 MHz

524288

32768

20 MHz

YES

2.6 V

MICROCONTROLLER, RISC

CMOS

FLASH

2.7 V

2.5 V

AUTOMOTIVE

S-PBGA-B388

Not Qualified

125 °C

-40 °C

240

388

PLASTIC/EPOXY

BGA

BGA388,26X26,40

SQUARE

GRID ARRAY

Tin/Lead/Silver (Sn62Pb36Ag2)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388

not_compliant

8542.31.00.01

BGA

388

3A991.A.2

MPC563MZP66R2

Motorola Mobility LLC

Check for Price

Transferred

66 MHz

20 MHz

YES

2.6 V

MICROCONTROLLER, RISC

CMOS

FLASH

2.7 V

2.5 V

AUTOMOTIVE

S-PBGA-B388

Not Qualified

125 °C

-40 °C

388

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1 mm

BOTTOM

2.55 mm

27 mm

MOTOROLA INC

BGA,

unknown

8542.31.00.01

BGA

388

MPC563MZP66R2

NXP Semiconductors

Check for Price

Not Recommended

66 MHz

524288

32768

20 MHz

YES

2.6 V

MICROCONTROLLER, RISC

CMOS

FLASH

2.7 V

2.5 V

AUTOMOTIVE

S-PBGA-B388

Not Qualified

125 °C

-40 °C

240

388

PLASTIC/EPOXY

BGA

BGA388,26X26,40

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388

unknown

8542.31.00.01

3A991.A.2

Parametric results for: MPC563MZP66R2 under Microcontrollers