Findchips: Parametric Search Results for MPC7410THX450NE


Select Parts		Part Number

		MPC7410THX450NE NXP Semiconductors
		MPC7410THX450NE Freescale Semiconductor

				Most Relevant							Technical								Compliance		Operating Conditions			Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

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Obsolete

450 MHz

133 MHz

YES

1.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.55 V

1.45 V

S-CBGA-B360

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HCTEBGA-360

unknown

3A991.A.1

8542.31.00.01

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Transferred

450 MHz

133 MHz

YES

1.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.55 V

1.45 V

S-CBGA-B360

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HCTEBGA-360

not_compliant

3A991.A.1

8542.31.00.01

BGA

360

Compare

MPC7410THX450NE

NXP Semiconductors

Check for Price

Obsolete

450 MHz

133 MHz

YES

1.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.55 V

1.45 V

S-CBGA-B360

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HCTEBGA-360

unknown

3A991.A.1

8542.31.00.01

MPC7410THX450NE

Freescale Semiconductor

Check for Price

Transferred

450 MHz

133 MHz

YES

1.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.55 V

1.45 V

S-CBGA-B360

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HCTEBGA-360

not_compliant

3A991.A.1

8542.31.00.01

BGA

360

Parametric results for: MPC7410THX450NE under Microprocessors