Findchips: Parametric Search Results for MPC8245LVV300D


Select Parts		Part Number

		MPC8245LVV300D Freescale Semiconductor
		MPC8245LVV300D Rochester Electronics LLC
		MPC8245LVV300D Motorola Mobility LLC
		MPC8245LVV300D Motorola Semiconductor Products
		MPC8245LVV300D NXP Semiconductors

				Most Relevant							Technical										Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Check for Price

Yes

Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.1 V

1.7 V

OTHER

S-PBGA-B352

Not Qualified

105 °C

245

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

FREESCALE SEMICONDUCTOR INC

BGA

35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352

352

not_compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Yes

Active

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.1 V

1.7 V

OTHER

S-PBGA-B352

COMMERCIAL

105 °C

245

352

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

ROCHESTER ELECTRONICS LLC

BGA

35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352

352

unknown

Check for Price

Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-PBGA-B352

Not Qualified

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

MOTOROLA INC

BGA

LBGA, BGA352,26X26,50

352

unknown

3A991.A.2

8542.31.00.01

Check for Price

Yes

Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-PBGA-B352

Not Qualified

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

MOTOROLA INC

35 X 35 MM, 1.27 MM PITCH, LEAD FREE, TBGA-352

unknown

3A991.A.2

8542.31.00.01

Check for Price

Yes

Obsolete

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.1 V

1.7 V

OTHER

S-PBGA-B352

Not Qualified

105 °C

245

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

NXP SEMICONDUCTORS

35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352

compliant

3A991.A.2

8542.31.00.01

NXP

Compare

MPC8245LVV300D

Freescale Semiconductor

Check for Price

Yes

Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.1 V

1.7 V

OTHER

S-PBGA-B352

Not Qualified

105 °C

245

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

FREESCALE SEMICONDUCTOR INC

BGA

35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352

352

not_compliant

3A991.A.2

8542.31.00.01

NXP

MPC8245LVV300D

Rochester Electronics LLC

Check for Price

Yes

Active

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.1 V

1.7 V

OTHER

S-PBGA-B352

COMMERCIAL

105 °C

245

352

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

ROCHESTER ELECTRONICS LLC

BGA

35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352

352

unknown

MPC8245LVV300D

Motorola Mobility LLC

Check for Price

Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-PBGA-B352

Not Qualified

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

MOTOROLA INC

BGA

LBGA, BGA352,26X26,50

352

unknown

3A991.A.2

8542.31.00.01

MPC8245LVV300D

Motorola Semiconductor Products

Check for Price

Yes

Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-PBGA-B352

Not Qualified

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

MOTOROLA INC

35 X 35 MM, 1.27 MM PITCH, LEAD FREE, TBGA-352

unknown

3A991.A.2

8542.31.00.01

MPC8245LVV300D

NXP Semiconductors

Check for Price

Yes

Obsolete

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.1 V

1.7 V

OTHER

S-PBGA-B352

Not Qualified

105 °C

245

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

NXP SEMICONDUCTORS

35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352

compliant

3A991.A.2

8542.31.00.01

NXP

Parametric results for: MPC8245LVV300D under Microprocessors