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MPC8245TZU266D
NXP Semiconductors
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Check for Price | No | Obsolete | 32 | 266 MHz | 32 | 32 | 66 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES AT 2V SUPPLY | YES | FLOATING POINT | YES | YES | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B352 | Not Qualified | e0 | 3 | 105 °C | -40 °C | 220 | 30 | 352 | PLASTIC/EPOXY | LBGA | BGA352,26X26,50 | SQUARE | GRID ARRAY, LOW PROFILE | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 1.27 mm | BOTTOM | 1.65 mm | 35 mm | 35 mm | NXP SEMICONDUCTORS | 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352 | not_compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||
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MPC8245TZU266D
Motorola Mobility LLC
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Check for Price | No | Transferred | 32 | 266 MHz | 32 | 32 | 66 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES AT 2V SUPPLY | YES | FLOATING POINT | YES | YES | 1.9 V | 1.7 V | S-PBGA-B352 | Not Qualified | NOT SPECIFIED | NOT SPECIFIED | 352 | PLASTIC/EPOXY | LBGA | BGA352,26X26,50 | SQUARE | GRID ARRAY, LOW PROFILE | BALL | 1.27 mm | BOTTOM | 1.65 mm | 35 mm | 35 mm | MOTOROLA INC | LBGA, BGA352,26X26,50 | unknown | 3A991.A.2 | 8542.31.00.01 | BGA | 352 | ||||||||||
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MPC8245TZU266D
Rochester Electronics LLC
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Check for Price | Yes | No | Active | 32 | 266 MHz | 32 | 32 | 66 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES AT 2V SUPPLY | YES | FLOATING POINT | YES | YES | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B352 | COMMERCIAL | e0 | 3 | 105 °C | -40 °C | 220 | 30 | 352 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | TIN LEAD | BALL | 1.27 mm | BOTTOM | 1.65 mm | 35 mm | 35 mm | ROCHESTER ELECTRONICS LLC | 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352 | unknown | BGA | 352 | ||||||
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MPC8245TZU266D
Motorola Semiconductor Products
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Check for Price | No | Transferred | 32 | 266 MHz | 32 | 32 | 66 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES AT 2V SUPPLY | YES | FLOATING POINT | YES | YES | 1.9 V | 1.7 V | S-PBGA-B352 | Not Qualified | NOT SPECIFIED | NOT SPECIFIED | 352 | PLASTIC/EPOXY | LBGA | BGA352,26X26,50 | SQUARE | GRID ARRAY, LOW PROFILE | BALL | 1.27 mm | BOTTOM | 1.65 mm | 35 mm | 35 mm | MOTOROLA INC | 35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352 | unknown | 3A991.A.2 | 8542.31.00.01 | ||||||||||||
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MPC8245TZU266D
Freescale Semiconductor
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Check for Price | No | No | Transferred | 32 | 266 MHz | 32 | 32 | 66 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES AT 2V SUPPLY | YES | FLOATING POINT | YES | YES | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B352 | Not Qualified | e0 | 3 | 105 °C | -40 °C | 220 | 30 | 352 | PLASTIC/EPOXY | LBGA | BGA352,26X26,50 | SQUARE | GRID ARRAY, LOW PROFILE | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 1.65 mm | 35 mm | 35 mm | FREESCALE SEMICONDUCTOR INC | 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352 | not_compliant | 3A991.A.2 | 8542.31.00.01 | NXP | BGA | 352 |