Findchips: Parametric Search Results for MPC8245TZU300D


Select Parts		Part Number

		MPC8245TZU300D Motorola Mobility LLC
		MPC8245TZU300D Freescale Semiconductor
		MPC8245TZU300D NXP Semiconductors
		MPC8245TZU300D Motorola Semiconductor Products

				Most Relevant							Technical										Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

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Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-PBGA-B352

Not Qualified

NOT SPECIFIED

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

MOTOROLA INC

BGA

LBGA, BGA352,26X26,50

352

unknown

3A991.A.2

8542.31.00.01

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Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

INDUSTRIAL

S-PBGA-B352

Not Qualified

105 °C

-40 °C

220

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

FREESCALE SEMICONDUCTOR INC

BGA

35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352

352

not_compliant

3A991.A.2

8542.31.00.01

NXP

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Obsolete

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

INDUSTRIAL

S-PBGA-B352

Not Qualified

105 °C

-40 °C

220

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

NXP SEMICONDUCTORS

TBGA-352

unknown

3A991.A.2

8542.31.00.01

NXP

Check for Price

Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-PBGA-B352

Not Qualified

NOT SPECIFIED

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

MOTOROLA INC

35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352

unknown

3A991.A.2

8542.31.00.01

Compare

MPC8245TZU300D

Motorola Mobility LLC

Check for Price

Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-PBGA-B352

Not Qualified

NOT SPECIFIED

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

MOTOROLA INC

BGA

LBGA, BGA352,26X26,50

352

unknown

3A991.A.2

8542.31.00.01

MPC8245TZU300D

Freescale Semiconductor

Check for Price

Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

INDUSTRIAL

S-PBGA-B352

Not Qualified

105 °C

-40 °C

220

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

FREESCALE SEMICONDUCTOR INC

BGA

35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352

352

not_compliant

3A991.A.2

8542.31.00.01

NXP

MPC8245TZU300D

NXP Semiconductors

Check for Price

Obsolete

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

INDUSTRIAL

S-PBGA-B352

Not Qualified

105 °C

-40 °C

220

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

NXP SEMICONDUCTORS

TBGA-352

unknown

3A991.A.2

8542.31.00.01

NXP

MPC8245TZU300D

Motorola Semiconductor Products

Check for Price

Transferred

300 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO OPERATES AT 2V SUPPLY

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-PBGA-B352

Not Qualified

NOT SPECIFIED

352

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

BALL

1.27 mm

BOTTOM

1.65 mm

35 mm

MOTOROLA INC

35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352

unknown

3A991.A.2

8542.31.00.01

Parametric results for: MPC8245TZU300D under Microprocessors