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Parametric results for: MPC8313EVRAFF under Microprocessors

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Manufacturer Part Number: mpc8313evraff
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MPC8313EVRAFFC
 NXP Semiconductors 		$28.5525 Yes Not Recommended 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516 compliant 5A002.A.1 8542.31.00.01 NXP
MPC8313EVRAFFA
 Freescale Semiconductor 		Check for Price Transferred 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.5 V 950 mV S-PBGA-B516 Not Qualified e1 516 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC HBGA, unknown 3A991.A.2 8542.31.00.01 BGA 516
MPC8313EVRAFFB
 Freescale Semiconductor 		Check for Price Yes Obsolete 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.5 V 950 mV OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516 compliant 5A002 8542.31.00.01 BGA 516
MPC8313EVRAFF
 Freescale Semiconductor 		Check for Price Yes Obsolete 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.5 V 950 mV OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516 compliant 5A002 8542.31.00.01 BGA 516
MPC8313EVRAFFA
 NXP Semiconductors 		Check for Price Active 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.5 V 950 mV S-PBGA-B516 Not Qualified e1 516 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516 unknown 3A991.A.2 8542.31.00.01
MPC8313EVRAFFC
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516 compliant 5A002.A 8542.31.00.01 NXP BGA 516